W25P16VSSIG Winbond Electronics, W25P16VSSIG Datasheet - Page 24

• Manufacturer Part Number: W25P16VSSIG
• Description: IC FLASH 16MBIT 50MHZ 8SOIC
• Manufacturer: Winbond Electronics

Specifications of W25P16VSSIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 16M (2M x 8)
• Speed: 50MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

W25P80 AND W25P16
When used to release the device from the power-down state and obtain the Device ID, the instruction
is the same as previously described, and shown in figure 13, except that after /CS is driven high it
must remain high for a time duration of t
(See AC Characteristics). After this time duration the
RES2
device will resume normal operation and other instructions will be accepted.
If the Release from Power-down / Device ID instruction is issued while an Erase, Program or Write
cycle is in process (when BUSY equals 1) the instruction is ignored and will not have any effects on
the current cycle.
Figure 14. Release Power-down Instruction Sequence
Figure 15. Release Power-down / Device ID Instruction Sequence Diagram
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