MT48H8M32LFB5-75:G TR Micron Technology Inc, MT48H8M32LFB5-75:G TR Datasheet - Page 13

• Manufacturer Part Number: MT48H8M32LFB5-75:G TR
• Description: IC SDRAM 256MBIT 132MHZ 90VFBGA
• Manufacturer: Micron Technology Inc
• Type: Mobile SDRAMr

Specifications of MT48H8M32LFB5-75:G TR

• Format - Memory: RAM
• Memory Type: Mobile SDRAM
• Memory Size: 256M (8Mx32)
• Speed: 132MHz
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.95 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 90-VFBGA
• Organization: 8Mx32
• Density: 256Mb
• Address Bus: 14b
• Access Time (max): 8/6ns
• Maximum Clock Rate: 133MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: VFBGA
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 1.95V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 100mA
• Pin Count: 90
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 557-1328-2

Package Dimensions
Figure 5: 54-Ball VFBGA (8mm x 9mm)
PDF: 09005aef834c13d2
256mb_mobile_sdram_y36n.pdf - Rev. I 11/09 EN
Ø0.4 SMD ball pads.
Dimensions apply
material: SAC105.
post-reflow
to solder balls
6.4 CTR
54X Ø0.45
Seating
plane
Solder ball
0.1 A
0.8 TYP
on
Note:
A
9
1. All dimensions are in millimeters.
8
7
6.4 CTR
8 ±0.1
0.8 TYP
3
2
1
256Mb: 16 Meg x 16, 8 Meg x 32 Mobile SDRAM
0.65 ±0.05
A
B
C
D
E
F
G
H
J
13
9 ±0.1
Ball A1 ID
Micron Technology, Inc. reserves the right to change products or specifications without notice.
0.25 MIN
1.0 MAX
Package Dimensions
©2008 Micron Technology, Inc. All rights reserved.
Ball A1 ID