IS42S32200C1-7TL ISSI, Integrated Silicon Solution Inc, IS42S32200C1-7TL Datasheet - Page 2

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IS42S32200C1-7TL

Manufacturer Part Number
IS42S32200C1-7TL
Description
IC SDRAM 64MBIT 143MHZ 86TSOP
Manufacturer
ISSI, Integrated Silicon Solution Inc
Type
SDRAMr
Datasheet

Specifications of IS42S32200C1-7TL

Format - Memory
RAM
Memory Type
SDRAM
Memory Size
64M (2Mx32)
Speed
143MHz
Interface
Parallel
Voltage - Supply
3.15 V ~ 3.45 V
Operating Temperature
0°C ~ 70°C
Package / Case
86-TSOPII
Organization
2Mx32
Density
64Mb
Address Bus
13b
Access Time (max)
8/5.5ns
Maximum Clock Rate
143MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
180mA
Pin Count
86
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
706-1021

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IS42S32200C1-7TL
Manufacturer:
ISSI
Quantity:
2 890
Part Number:
IS42S32200C1-7TL-TR
Manufacturer:
ISSI
Quantity:
7 257
IS42S32200C1
GENERAL DESCRIPTION
The 64Mb SDRAM is a high speed CMOS, dynamic
random-access memory designed to operate in 3.3V
memory systems containing 67,108,864 bits. Internally
configured as a quad-bank DRAM with a synchronous
interface. Each 16,777,216-bit bank is organized as 2,048
rows by 256 columns by 32 bits.
The 64Mb SDRAM includes an AUTO REFRESH MODE,
and a power-saving, power-down mode. All signals are
registered on the positive edge of the clock signal, CLK.
All inputs and outputs are LVTTL compatible.
The 64Mb SDRAM has the ability to synchronously burst
data at a high data rate with automatic column-address
generation, the ability to interleave between internal banks
to hide precharge time and the capability to randomly
change column addresses on each clock cycle during
burst access.
A self-timed row precharge initiated at the end of the burst
sequence is available with the AUTO PRECHARGE
FUNCTIONAL BLOCK DIAGRAM
2
CKE
RAS
CAS
A10
CLK
BA0
BA1
WE
CS
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
GENERATOR
COMMAND
DECODER
11
CLOCK
&
ADDRESS
LATCH
ROW
ADDRESS BUFFER
BURST COUNTER
ADDRESS LATCH
REGISTER
MODE
COLUMN
COLUMN
11
Integrated Silicon Solution, Inc. — www.issi.com —
11
CONTROLLER
REFRESH
COUNTER
REFRESH
CONTROLLER
REFRESH
ADDRESS
BUFFER
SELF
ROW
function enabled. Precharge one bank while accessing one
of the other three banks will hide the precharge cycles and
provide seamless, high-speed, random-access operation.
SDRAM read and write accesses are burst oriented starting
at a selected location and continuing for a programmed
number of locations in a programmed sequence. The
registration of an ACTIVE command begins accesses,
followed by a READ or WRITE command. The ACTIVE
command in conjunction with address bits registered are
used to select the bank and row to be accessed (BA0, BA1
select the bank; A0-A10 select the row). The READ or
WRITE commands in conjunction with address bits reg-
istered are used to select the starting column location for
the burst access.
Programmable READ or WRITE burst lengths consist of
1, 2, 4 and 8 locations or full page, with a burst terminate
option.
BANK CONTROL LOGIC
11
2048
32
32
2048
2048
2048
DATA OUT
BUFFER
BUFFER
DATA IN
(x 32)
256
COLUMN DECODER
SENSE AMP I/O GATE
MEMORY CELL
BANK 0
32
32
ARRAY
DQM0-3
DQ 0-31
V
GND/GNDQ
DD
/V
DDQ
1-800-379-4774
1/18/07
Rev. B

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