MT47H32M16BN-25E IT:D TR Micron Technology Inc, MT47H32M16BN-25E IT:D TR Datasheet - Page 4

• Manufacturer Part Number: MT47H32M16BN-25E IT:D TR
• Description: IC DDR2 SDRAM 512MBIT 84FBGA
• Manufacturer: Micron Technology Inc
• Type: DDR2 SDRAMr

Specifications of MT47H32M16BN-25E IT:D TR

• Format - Memory: RAM
• Memory Type: DDR2 SDRAM
• Memory Size: 512M (32Mx16)
• Speed: 2.5ns
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.9 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 84-FBGA
• Organization: 32Mx16
• Density: 512Mb
• Address Bus: 15b
• Access Time (max): 400ps
• Maximum Clock Rate: 800MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: FBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 295mA
• Pin Count: 84
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Contents
State Diagram .................................................................................................................................................. 9
Functional Description ................................................................................................................................... 10
Functional Block Diagrams ............................................................................................................................. 12
Ball Assignments and Descriptions ................................................................................................................. 15
Packaging ...................................................................................................................................................... 20
Electrical Specifications – Absolute Ratings ..................................................................................................... 27
Electrical Specifications – Idd Parameters ........................................................................................................ 30
AC Timing Operating Specifications ................................................................................................................ 35
AC and DC Operating Conditions .................................................................................................................... 46
ODT DC Electrical Characteristics ................................................................................................................... 47
Input Electrical Characteristics and Operating Conditions ............................................................................... 48
Output Electrical Characteristics and Operating Conditions ............................................................................. 51
Output Driver Characteristics ......................................................................................................................... 53
Power and Ground Clamp Characteristics ....................................................................................................... 57
AC Overshoot/Undershoot Specification ......................................................................................................... 58
Input Slew Rate Derating ................................................................................................................................ 60
Commands .................................................................................................................................................... 74
Mode Register (MR) ........................................................................................................................................ 80
Extended Mode Register (EMR) ....................................................................................................................... 86
PDF: 09005aef82f1e6e2
Rev. M 9/08 EN
Industrial Temperature .............................................................................................................................. 10
Automotive Temperature ........................................................................................................................... 11
General Notes ............................................................................................................................................ 11
Package Dimensions .................................................................................................................................. 20
FBGA Package Capacitance ......................................................................................................................... 26
Temperature and Thermal Impedance ........................................................................................................ 27
Idd Specifications and Conditions ............................................................................................................... 30
Idd7 Conditions ......................................................................................................................................... 31
Truth Tables ............................................................................................................................................... 74
DESELECT ................................................................................................................................................. 78
NO OPERATION (NOP) .............................................................................................................................. 79
LOAD MODE (LM) ..................................................................................................................................... 79
ACTIVATE .................................................................................................................................................. 79
READ ......................................................................................................................................................... 79
WRITE ....................................................................................................................................................... 79
PRECHARGE .............................................................................................................................................. 80
REFRESH ................................................................................................................................................... 80
SELF REFRESH ........................................................................................................................................... 80
Burst Length .............................................................................................................................................. 81
Burst Type ................................................................................................................................................. 81
Operating Mode ......................................................................................................................................... 83
DLL RESET ................................................................................................................................................. 83
Write Recovery ........................................................................................................................................... 84
Power-Down Mode .................................................................................................................................... 84
CAS Latency (CL) ........................................................................................................................................ 85
DLL Enable/Disable ................................................................................................................................... 87
Output Drive Strength ................................................................................................................................ 87
DQS# Enable/Disable ................................................................................................................................. 87
RDQS Enable/Disable ................................................................................................................................. 87
Output Enable/Disable ............................................................................................................................... 87
On-Die Termination (ODT) ........................................................................................................................ 88
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
512Mb: x4, x8, x16 DDR2 SDRAM
© 2004 Micron Technology, Inc. All rights reserved.