MT28F128J3RP-12 ET TR Micron Technology Inc, MT28F128J3RP-12 ET TR Datasheet - Page 53

• Manufacturer Part Number: MT28F128J3RP-12 ET TR
• Description: IC FLASH 128MBIT 120NS 56TSOP
• Manufacturer: Micron Technology Inc

Specifications of MT28F128J3RP-12 ET TR

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 128M (16Mx8, 8Mx16)
• Speed: 120ns
• Interface: Parallel
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 56-TSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NOTE:
09005aef80b5a323
MT28F640J3.fm – Rev. N 3/05 EN
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER IS Ø 0.40
E-mail: [e-mail], Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
All dimensions in millimeters.
SEATING PLANE
64X ∅0.45
7.00
0.10 C
BALL A8
3.50 ±0.05
0.850 ±0.075
Micron, the M logo, the Micron logo, and Q-Flash are trademarks of Micron Technology, Inc.
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
C
3.50 ±0.05
1.00 TYP
All other trademarks are the property of their respective owners.
10.00 ±0.10
7.00
C L
5.00 ±0.05
Figure 23: 64-Ball FBGA
1.00 TYP
C L
6.50 ±0.05
BALL A1
BALL A1 ID
13.00 ±0.10
53
®
Micron Technology, Inc., reserves the right to change products or specifications without notice..
1.20 MAX
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE MATERIAL: PLASTIC LAMINATE
SOLDER BALL MATERIAL: 62% Sn, 36% Pb, 2% Ag OR
96.5% Sn, 3% Ag, 0.5% Cu
SOLDER BALL PAD: Ø 0.33 NON SOLDER MASK DEFINED
128Mb, 64Mb, 32Mb
Q-FLASH MEMORY
BALL A1 ID
©2000 Micron Technology, Inc