AT24C256B-PU Atmel, AT24C256B-PU Datasheet - Page 13

• Manufacturer Part Number: AT24C256B-PU
• Description: IC EEPROM 256KBIT 1MHZ 8DIP
• Manufacturer: Atmel

Specifications of AT24C256B-PU

• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Memory Size: 256K (32K x 8)
• Speed: 400kHz, 1MHz
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

8. AT24C256B Ordering Codes
Notes:
5279C–SEEPR–3/09
Ordering Code
AT24C256B-PU (Bulk Form Only)
AT24C256BN-SH-B
AT24C256BN-SH-T
AT24C256BW-SH-B
AT24C256BW-SH-T
AT24C256B-TH-B
AT24C256B-TH-T
AT24C256BY7-YH-T
AT24C256BU2-UU-T
AT24C256B-W-11
8P3
8S1
8S2
8U2-1
8A2
8Y7
1.8
1. “-B” denotes bulk.
2. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP and dBGA2 = 5K per reel. SAP = 3K per reel. EIAJ = 2K per reel.
3. Available in tape & reel and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request. Please
contact Serial Interface Marketing.
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8-lead, 0.200” Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC)
8-ball, die Ball Grid Array Package (dBGA2)
8-lead, 4.40 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8-lead, 6.00 mm x 4.90 mm Body, Ultra Thin, Dual Footprint, Non-leaded, Small Array Package (SAP)
Low-voltage (1.8V to 5.5V)
(2)
(1)
(1)
(2)
(2)
(1)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(2)
(2)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
Package Type
Voltage
Options
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
Package
Die Sale
8U2-1
8P3
8S1
8S1
8S2
8S2
8A2
8A2
8Y7
Lead-free/Halogen-free
Industrial Temperature
Industrial Temperature
Operation Range
40C to 85C)
40C to 85C)
AT24C256B
13