CY14E256LA-SZ25XI Cypress Semiconductor Corp, CY14E256LA-SZ25XI Datasheet - Page 3

• Manufacturer Part Number: CY14E256LA-SZ25XI
• Description: IC NVSRAM 256KBIT 25NS 32SOIC
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY14E256LA-SZ25XI

• Memory Size: 256K (32K x 8)
• Package / Case: *
• Format - Memory: RAM
• Memory Type: NVSRAM (Non-Volatile SRAM)
• Speed: 25ns
• Interface: Parallel
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Organization: 32 K x 8
• Access Time: 25 ns
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 2.7 V
• Operating Current: 70 mA
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Pinouts
Table 1. Pin Definitions
Document Number: 001-54952 Rev. *D
Notes
DQ
1. Address expansion for 1 Mbit. NC pin not connected to die
2. Address expansion for 2 Mbit. NC pin not connected to die.
3. Address expansion for 4 Mbit. NC pin not connected to die.
4. Address expansion for 8 Mbit. NC pin not connected to die.
5. Address expansion for 16 Mbit. NC pin not connected to die.
Pin Name
A
NC
0
V
DQ
DQ
DQ
HSB
DQ
0
NC
NC
V
V
WE
V
V
WE
CE
OE
NC
NC
– A
CE
A
CAP
A
A
CC
SS
A
A
– DQ
CC
A
A
SS
A
A
A
[5]
8
9
7
5
6
0
1
0
1
2
3
2
3
4
14
10
11
12
13
14
16
17
18
19
7
1
2
3
4
5
6
7
8
9
15
20
21
22
Input/Output Bidirectional Data I/O Lines. Used as input or output lines depending on operation.
Input/Output Hardware STORE Busy (HSB). When LOW, this output indicates that a Hardware STORE is in progress.
No Connect No Connect. This pin is not connected to the die.
(not to scale)
I/O Type
Ground
44 - TSOP II
Supply
Supply
Power
Power
Input
Input
Input
Input
Top View
(x8)
Address Inputs Used to Select One of the 32,768 bytes of the nvSRAM.
Write Enable Input, Active LOW. When the chip is enabled and WE is LOW, data on the I/O pins is written
to the specific address location.
Chip Enable Input, Active LOW. When LOW, selects the chip. When HIGH, deselects the chip.
Output Enable, Active LOW. The active LOW OE input enables the data output buffers during read
cycles. I/O pins are tri-stated on deasserting OE HIGH.
Ground for the Device. Must be connected to the ground of the system.
Power Supply Inputs to the Device.
When pulled LOW, external to the chip, it initiates a nonvolatile STORE operation. After each Hardware
and Software STORE operation HSB is driven HIGH for a short time (t
current and then a weak internal pullup resistor keeps this pin HIGH (external pullup resistor connection
is optional).
AutoStore Capacitor. Supplies power to the nvSRAM during power loss to store data from SRAM to
nonvolatile elements.
38
23
44
43
42
39
37
36
35
33
32
31
30
29
28
25
24
41
40
34
27
26
HSB
OE
Figure 1. Pin Diagram - 44 Pin TSOP II/32 Pin SOIC
NC
DQ
DQ
V
A
NC
NC
NC
NC
V
DQ
DQ
V
A
A
A
A
NC
NC
NC
SS
14
CC
11
CAP
13
12
10
[4]
[3]
[2]
7
6
4
5
[1]
[1]
Description
(not to scale)
32 - SOIC
Top View
(x8)
HHHD
) with standard output high
CY14E256LA
Page 3 of 18
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