MT29F2G08ABAEAH4-IT:E Micron Technology Inc, MT29F2G08ABAEAH4-IT:E Datasheet - Page 106

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MT29F2G08ABAEAH4-IT:E

Manufacturer Part Number
MT29F2G08ABAEAH4-IT:E
Description
IC FLASH 2G 3.3V SLC 63VFBGA
Manufacturer
Micron Technology Inc
Datasheet

Specifications of MT29F2G08ABAEAH4-IT:E

Format - Memory
FLASH
Memory Type
FLASH - Nand
Memory Size
2G (256M x 8)
Interface
Parallel
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
63-VFBGA
Cell Type
NAND
Density
2Gb
Interface Type
Parallel
Address Bus
28b
Operating Supply Voltage (typ)
3.3V
Operating Temp Range
-40C to 85C
Package Type
VFBGA
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8b
Number Of Words
256M
Supply Current
35mA
Mounting
Surface Mount
Pin Count
63
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Speed
-
Lead Free Status / Rohs Status
Compliant

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Electrical Specifications – DC Characteristics and Operating Conditions
Table 24: DC Characteristics and Operating Conditions (3.3V)
PDF: 09005aef83b83f42
m69a_2gb_nand.pdf – Rev. H 09/10 EN
Parameter
Sequential READ current
PROGRAM current
ERASE current
Standby current (TTL)
Standby current (CMOS)
Staggered power-up cur-
rent
Input leakage current
Output leakage current
Input high voltage
Input low voltage, all in-
puts
Output high voltage
Output low voltage
Output low current
Notes:
t
RC =
CE#, CLE, ALE, WE#, RE#,
Line capacitance = 0.1µF
1. Measurement is taken with 1ms averaging intervals and begins after V
2. I
3. V
I/O[7:0], I/O[15:0],
CE# = V
V
Rise time = 1ms
V
t
WP# = 0V/V
WP# = 0V/V
OUT
RC (MIN); CE# = V
I
Conditions
IN
OL
OH
I
I
Electrical Specifications – DC Characteristics and Operating
OL
V
OH
OUT
CE# = V
= 0V to V
OL
(RB#) may need to be relaxed if R/B pull-down strength is not set to full.
= 0V to V
= –400µA
= 2.1mA
WP#
and V
= 0.4V
= 0mA
CC
- 0.2V;
IH
OL
;
CC
CC
CC
CC
may need to be relaxed if I/O drive strength is not set to full.
IL
;
I
Symbol
OL
V
I
I
I
V
I
I
V
I
V
(R/B#)
CC1
CC2
CC3
I
SB1
SB2
I
LO
106
ST
OH
LI
OL
IH
IL
0.67 x V
0.8 x V
Min
–0.3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
8
2Gb: x8, x16 NAND Flash Memory
CC
CC
Typ
25
25
25
10
10
10 per die
V
0.2 x V
CC
Max
±10
±10
0.4
35
35
35
50
1
+ 0.3
© 2009 Micron Technology, Inc. All rights reserved.
CC
CC
Unit
mA
mA
mA
mA
mA
mA
µA
µA
µA
V
V
V
V
reaches V
Conditions
Notes
CC
1
3
3
2
(MIN).

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