W25Q32BVZPIG Winbond Electronics, W25Q32BVZPIG Datasheet - Page 77

• Manufacturer Part Number: W25Q32BVZPIG
• Description: IC SPI FLASH 32MBIT 8WSON
• Manufacturer: Winbond Electronics

Specifications of W25Q32BVZPIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 32M (4M x 8)
• Speed: 104MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-WSON
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

10. ORDERING INFORMATION
Notes:
1.
2.
3.
4.
W
25Q = SpiFlash Serial Flash Memory with 4KB sectors, Dual/Quad I/O
32B = 32M-bit
V = 2.7V to 3.6V
SS = 8-pin SOIC 208-mil
SF = 16-pin SOIC 300-mil
G =
P
I
A = Automotive (-40°C to +105°C)
The “W” prefix is not included on the part marking.
Only the 2
marking.
Standard bulk shipments are in Tube (shape E). Please specify alternate packing method, such as Tape and
Reel (shape T) or Tray (shape S), when placing orders.
For shipments with OTP feature enabled, please specify when placing orders.
= Industrial (-40°C to +85°C)
=
= Winbond
Green Package (Lead-free, RoHS Compliant, Halogen-free (TBBA), Antimony-Oxide-free Sb
Green Package with Status Register Power-Down & OTP enabled
nd
letter is used for the part marking; WSON package type ZP and ZE are not used for the part
(3,4)
ZP = 8-pad WSON 6x5mm
ZE = 8-pad WSON 8x6mm
- 77 -
DA = 8-pin PDIP 300-mil
TC = 24-ball TFBGA 8x6mm
W
(1)
25Q 32B V xx
Publication Release Date: April 01, 2011
W25Q32BV
2
O
(2)
3
)
Revision F