BZA962AVL T/R NXP Semiconductors, BZA962AVL T/R Datasheet - Page 8

• Manufacturer Part Number: BZA962AVL T/R
• Description: TVS Diode Arrays DIODE ARRAY TAPE-7
• Manufacturer: NXP Semiconductors
• Series: BZA900AVLr

Specifications of BZA962AVL T/R

• Product Category: TVS Diode Arrays
• Rohs: yes
• Polarity: Unidirectional
• Channels: 4 Channels
• Operating Voltage: 6.51 V
• Peak Surge Current: 0.85 A
• Mounting Style: SMD/SMT
• Termination Style: SMD/SMT
• Dimensions: 1.3 (Max) mm W x 1.7 (Max) mm L
• Package / Case: SOT-665
• Peak Pulse Power Dissipation: 6 W
• Factory Pack Quantity: 4000
• Part # Aliases: BZA962AVL,115

NXP Semiconductors
Device placement and printed-circuit board layout
Circuit board layout is of extreme importance in the
suppression of transients. The clamping voltage of the
BZA900AVL is determined by the peak transient current
and the rate of rise of that current (di/dt). Since parasitic
inductances can further add to the clamping voltage
(V = L di/dt) the series conductor lengths on the
printed-circuit board should be kept to a minimum. This
includes the lead length of the suppression element.
In addition to minimizing conductor length the following
printed-circuit board layout guidelines are recommended:
1. Place the suppression element close to the input
2. Keep parallel signal paths to a minimum
3. Avoid running protection conductors in parallel with
4. Minimize all printed-circuit board loop areas including
5. Minimize the length of the transient return path to
6. Avoid using shared transient return paths to a common
2003 Oct 20
Quadruple low capacitance ESD
suppressor
terminals or connectors
unprotected conductors
power and ground loops
ground
ground point.
8
BZA900AVL series
Product data sheet