PRTR5V0U4AD T/R NXP Semiconductors, PRTR5V0U4AD T/R Datasheet

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PRTR5V0U4AD T/R

Manufacturer Part Number
PRTR5V0U4AD T/R
Description
TVS Diode Arrays DUAL USB 2.0 ESD PROTECTION
Manufacturer
NXP Semiconductors
Series
PRTR5V0U4ADr
Datasheet

Specifications of PRTR5V0U4AD T/R

Product Category
TVS Diode Arrays
Rohs
yes
Polarity
Unidirectional
Channels
4 Channels
Breakdown Voltage
6 V
Mounting Style
SMD/SMT
Termination Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Maximum Operating Temperature
+ 85 C
Dimensions
1.7 (Max) mm W x 3.1 (Max) mm L
Package / Case
TSOP
Factory Pack Quantity
3000
Part # Aliases
PRTR5V0U4AD,125
1. Product profile
1.1 General description
1.2 Features
1.3 Applications
The PRTR5V0U4AD is designed to protect Input/Output (I/O) ports that are sensitive
concerning capacitive load, such as USB 2.0, Ethernet, Digital Video Interface (DVI), etc.
from destruction by ElectroStatic Discharges (ESD). It provides protection to downstream
signal and supply components from ESD voltages as high as 8 kV (contact discharge).
The PRTR5V0U4AD incorporates four pairs of ultra-low capacitance rail-to-rail diodes
plus an additional Zener diode. The rail-to-rail diodes are connected to the Zener diode
which allows ESD protection to be independent of the availability of a supply voltage.
The PRTR5V0U4AD is fabricated using thin film-on-silicon technology integrating four
ultra-low capacitance rail-to-rail ESD protection diodes in a miniature 6-lead SOT457
package.
I
I
I
I
I
PRTR5V0U4AD
Integrated quad ultra-low capacitance ESD protection
Rev. 01 — 17 December 2007
ESD protection compliant to IEC 61000-4-2 level 4, 8 kV contact discharge
Low voltage clamping due to integrated Zener diode
Four ultra-low input capacitance (1 pF typical) rail-to-rail ESD protection diodes
Small 6-lead SOT457 package
General-purpose downstream ESD protection of high frequency analog signals and
high-speed serial data transmission for ports inside:
N
N
N
N
N
N
Cellular mobile handsets
USB 2.0 and IEEE 1394 ports in PC or notebook
Interfaces: DVI and High Definition Multimedia Interface (HDMI)
Cordless telephones
Wireless data systems: Wide Area Network (WAN) and Local Area Network (LAN)
Personal Digital Assistants (PDAs)
Product data sheet

Related parts for PRTR5V0U4AD T/R

PRTR5V0U4AD T/R Summary of contents

Page 1

PRTR5V0U4AD Integrated quad ultra-low capacitance ESD protection Rev. 01 — 17 December 2007 1. Product profile 1.1 General description The PRTR5V0U4AD is designed to protect Input/Output (I/O) ports that are sensitive concerning capacitive load, such as USB 2.0, Ethernet, Digital ...

Page 2

... NXP Semiconductors 2. Pinning information Table 1. Pin Ordering information Table 2. Type number PRTR5V0U4AD 4. Limiting values Table 3. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol esd T stg 5. Recommended operating conditions Table 4. Symbol T amb PRTR5V0U4AD_1 Product data sheet ...

Page 3

... NXP Semiconductors 6. Characteristics Table unless otherwise specified. amb Symbol C (I/O-GND sup V F [1] Measured from pins and 6 to ground (GND). [2] Measured from pin 2 to ground (GND). 7. Application information The PRTR5V0U4AD is optimized to protect e.g. two USB 2.0 ports against ESD. Each ...

Page 4

... NXP Semiconductors 8. Package outline Plastic surface-mounted package (TSOP6); 6 leads y 6 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT b p 0.1 0.40 1.1 0.26 mm 0.013 0.25 0.9 0.10 OUTLINE VERSION IEC SOT457 Fig 2. Package outline SOT457 (TSOP6) PRTR5V0U4AD_1 Product data sheet Integrated quad ultra-low capacitance ESD protection ...

Page 5

... NXP Semiconductors 9. Revision history Table 6. Revision history Document ID Release date PRTR5V0U4AD_1 20071217 PRTR5V0U4AD_1 Product data sheet Integrated quad ultra-low capacitance ESD protection Data sheet status Change notice Product data sheet - Rev. 01 — 17 December 2007 PRTR5V0U4AD Supersedes - © NXP B.V. 2007. All rights reserved. ...

Page 6

... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

Page 7

... NXP Semiconductors 12. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Limiting values Recommended operating conditions Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Application information Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 5 10 Legal information 10.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 6 10.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 10 ...

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