IS42S16160B-7BLI ISSI, Integrated Silicon Solution Inc, IS42S16160B-7BLI Datasheet - Page 2
![no-image](/images/manufacturer_photos/0/3/347/issi__integrated_silicon_solution_inc_sml.jpg)
IS42S16160B-7BLI
Manufacturer Part Number
IS42S16160B-7BLI
Description
IC SDRAM 256MBIT 143MHZ 54BGA
Manufacturer
ISSI, Integrated Silicon Solution Inc
Type
SDRAMr
Datasheet
1.IS42S16160B-7TLI-TR.pdf
(62 pages)
Specifications of IS42S16160B-7BLI
Format - Memory
RAM
Memory Type
SDRAM
Memory Size
256M (16Mx16)
Speed
143MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
54-BGA
Organization
16Mx16
Density
256Mb
Address Bus
15b
Access Time (max)
6.5/5.4ns
Maximum Clock Rate
143MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
130mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
IS42S16160B-7BLI
Manufacturer:
ISSI, Integrated Silicon Solution Inc
Quantity:
10 000
Company:
Part Number:
IS42S16160B-7BLI-TR
Manufacturer:
ISSI, Integrated Silicon Solution Inc
Quantity:
10 000
IS42S83200B,
DEVICE OVERVIEW
The 256Mb SDRAM is a high speed CMOS, dynamic
random-access memory designed to operate in 3.3V V
and 3.3V V
bits. Internally configured as a quad-bank DRAM with a
synchronous interface. Each 67,108,864-bit bank is orga-
nized as 8,192 rows by 512 columns by 16 bits or 8,192 rows
by 1,024 columns by 8 bits.
The 256Mb SDRAM includes an AUTO REFRESH MODE,
and a power-saving, power-down mode. All signals are
registered on the positive edge of the clock signal, CLK. All
inputs and outputs are LVTTL compatible.
The 256Mb SDRAM has the ability to synchronously burst
data at a high data rate with automatic column-address
generation, the ability to interleave between internal banks
to hide precharge time and the capability to randomly
change column addresses on each clock cycle during burst
access.
FUNCTIONAL BLOCK DIAGRAM (FOR 4MX16X4 BANKS SHOWN)
2
CKE
RAS
CAS
A10
A12
CLK
BA0
BA1
A11
WE
CS
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
DDQ
memory systems containing 268,435,456
GENERATOR
COMMAND
DECODER
13
CLOCK
&
ADDRESS
LATCH
ROW
IS42S16160B
9
ADDRESS BUFFER
BURST COUNTER
ADDRESS LATCH
REGISTER
MODE
COLUMN
COLUMN
13
13
CONTROLLER
REFRESH
COUNTER
REFRESH
CONTROLLER
REFRESH
ADDRESS
BUFFER
SELF
DD
ROW
A self-timed row precharge initiated at the end of the burst
sequence is available with the AUTO PRECHARGE func-
tion enabled. Precharge one bank while accessing one of the
other three banks will hide the precharge cycles and provide
seamless, high-speed, random-access operation.
SDRAM read and write accesses are burst oriented starting at
a selected location and continuing for a programmed num-
ber of locations in a programmed sequence. The registra-
tion of an ACTIVE command begins accesses, followed by
a READ or WRITE command. The ACTIVE command in
conjunction with address bits registered are used to select
the bank and row to be accessed (BA0, BA1 select the
bank; A0-A12 select the row). The READ or WRITE
commands in conjunction with address bits registered are
used to select the starting column location for the burst
access.
Programmable READ or WRITE burst lengths consist of 1,
2, 4 and 8 locations or full page, with a burst terminate
option.
BANK CONTROL LOGIC
Integrated Silicon Solution, Inc. — www.issi.com
13
8192
16
16
8192
8192
8192
DATA OUT
BUFFER
BUFFER
9
DATA IN
(x 16)
COLUMN DECODER
512
SENSE AMP I/O GATE
MEMORY CELL
BANK 0
16
16
ARRAY
2
DQML
DQMH
DQ 0-15
V
V
DD
ss
/V
/V
ss
DDQ
Q
07/28/08
Rev. D