6ED100E12-F2_EVAL Infineon Technologies, 6ED100E12-F2_EVAL Datasheet - Page 16
6ED100E12-F2_EVAL
Manufacturer Part Number
6ED100E12-F2_EVAL
Description
Power Management IC Development Tools
Manufacturer
Infineon Technologies
Datasheet
1.6ED100E12-F2_EVAL.pdf
(41 pages)
- Current page: 16 of 41
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Using the baseplate temperature and a thermal model the junction temperature can be estimated. The
complexity of the thermal model needed for this purpose depends on application and heatsinking conditions
as well as on requirements on accuracy and dynamic response. In case of a broken wire the output switches
down to 0 V. Output voltage vs. baseplate temperature is shown in Figure 14, assuming that the circuit
according to Figure 12 is used to convert the digital signal to an analog signal.
Figure 14
Note: This temperature measurement is not suitable for short circuit detection or short term overload and
may be used to protect the module from long term overload conditions or malfunction of the cooling system.
Application Note
6
5
4
3
2
1
0
-50
Characteristics of the temperature measurement
-30
-10
Temperature Measurement V
10
Driver board for EconoDUAL™3 and EconoPACK™+
30
16
T
J
50
[°C]
70
TEMP
=f(T
J
90
)
110
Switching losses
130
V1.2, 2009-08
AN2008-02
150
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