PMST3906 /T3 NXP Semiconductors, PMST3906 /T3 Datasheet
PMST3906 /T3
Specifications of PMST3906 /T3
Related parts for PMST3906 /T3
PMST3906 /T3 Summary of contents
Page 1
PMST3906 40 V, 200 mA PNP switching transistor Rev. 05 — 29 April 2009 1. Product profile 1.1 General description PNP switching transistor in a SOT323 (SC-70) very small Surface-Mounted Device (SMD) plastic package. NPN complement: PMST3904. 1.2 Features I ...
Page 2
... NXP Semiconductors 3. Ordering information Table 3. Type number PMST3906 4. Marking Table 4. Type number PMST3906 [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V CBO V CEO V EBO ...
Page 3
... NXP Semiconductors 7. Characteristics Table unless otherwise specified. amb Symbol I CBO I EBO CEsat V BEsat off PMST3906_5 Product data sheet Characteristics Parameter Conditions collector-base cut-off current emitter-base cut-off ...
Page 4
... NXP Semiconductors 600 h FE (1) 400 (2) 200 ( ( 150 C amb ( amb ( amb Fig 1. DC current gain as a function of collector current; typical values 1200 V BE (mV) 1000 (1) 800 (2) 600 (3) 400 200 ...
Page 5
... NXP Semiconductors (1) T (2) T (3) T Fig 5. 8. Test information Fig 6. PMST3906_5 Product data sheet CEsat (mV) ( 150 C amb = 25 C amb = 55 C amb Collector-emitter saturation voltage as a function of collector current; typical values R (probe) oscilloscope 450 ...
Page 6
... NXP Semiconductors 9. Package outline Fig 7. 10. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package Description PMST3906 [1] For further information and the availability of packing methods, see PMST3906_5 Product data sheet 2.2 1.8 2.2 1.35 2.0 1.15 1 1.3 Dimensions in mm ...
Page 7
... NXP Semiconductors 11. Soldering Fig 8. 3.65 2.1 Fig 9. PMST3906_5 Product data sheet 2.65 1.85 1.325 2 0 Reflow soldering footprint SOT323 (SC-70) 4.6 2.575 1.425 (3 ) Wave soldering footprint SOT323 (SC-70) Rev. 05 — 29 April 2009 PMST3906 40 V, 200 mA PNP switching transistor solder lands solder resist solder paste 1.3 occupied area ...
Page 8
... Document ID Release date PMST3906_5 20090429 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Figure • Figure • ...
Page 9
... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
Page 10
... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 10 Packing information Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 Revision history ...