PMP4201G T/R NXP Semiconductors, PMP4201G T/R Datasheet
PMP4201G T/R
Specifications of PMP4201G T/R
Related parts for PMP4201G T/R
PMP4201G T/R Summary of contents
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... PMP4201Y NPN/NPN matched double transistors Rev. 04 — 28 August 2009 1. Product profile 1.1 General description NPN/NPN matched double transistors in small Surface-Mounted Device (SMD) plastic packages. The transistors in the SOT666 and SOT363 (SC-88) packages are fully isolated internally. Table 1. Type number PMP4201V PMP4201G PMP4201Y 1 ...
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... NXP Semiconductors Table 2. Symbol Per device h /h FE1 FE2 V V BE1 [1] The smaller of the two values is taken as the numerator. [2] The smaller of the two values is subtracted from the larger value. 2. Pinning information Table 3. Pin SOT666; SOT363 SOT353 ...
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... NXP Semiconductors 4. Marking Table 5. Type number PMP4201V PMP4201G PMP4201Y [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per transistor V CBO V CEO V EBO tot ...
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... NXP Semiconductors 6. Thermal characteristics Table 7. Symbol Per transistor R th(j-a) Per device R th(j-a) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. 7. Characteristics Table unless otherwise specified amb Symbol Per transistor ...
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... NXP Semiconductors Table unless otherwise specified amb Symbol Per device h /h FE1 FE2 V V BE1 [1] V BEsat [ [3] The smaller of the two values is taken as the numerator. [4] The smaller of the two values is subtracted from the larger value. ...
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... NXP Semiconductors 0.20 I (mA 4.05 C 3.60 (A) 3.15 0.16 0.12 0.08 0. amb Fig 1. Collector current as a function of collector-emitter voltage; typical values 1.3 V BEsat (V) 1.1 0.9 (1) (2) 0.7 (3) 0.5 0 amb ( amb ( 100 C amb Fig 3. Base-emitter saturation voltage as a function of collector current; typical values ...
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... NXP Semiconductors (V) 0.8 0.6 0 amb Fig 5. Base-emitter voltage as a function of collector current; typical values (pF MHz amb Fig 7. Collector capacitance as a function of collector-base voltage; typical values PMP4201V_G_Y_4 Product data sheet PMP4201V ...
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... NXP Semiconductors 8. Application information TR1 006aaa523 Fig 9. Current mirror 9. Package outline 1.7 1 1.7 1.3 1.5 1.1 pin 1 index 1 2 0.5 1 Dimensions in mm Fig 11. Package outline SOT666 Fig 13. Package outline SOT363 (SC-88) PMP4201V_G_Y_4 Product data sheet PMP4201V; PMP4201G; PMP4201Y l out TR2 Fig 10. Differential amplifier 0.6 0.5 4 0.3 0.1 2.2 2.0 3 0.18 0.27 0.08 0.17 04-11-08 Dimensions in mm Fig 12 ...
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... NXP Semiconductors 10. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number PMP4201V PMP4201G PMP4201Y [1] For further information and the availability of packing methods, see [2] T1: normal taping [3] T2: reverse taping 11. Soldering 2 1.7 Fig 14. Reflow soldering footprint SOT666 ...
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... NXP Semiconductors Fig 15. Reflow soldering footprint SOT353 (SC-88A) 0.85 4.5 0.85 Fig 16. Wave soldering footprint SOT353 (SC-88A) PMP4201V_G_Y_4 Product data sheet PMP4201V; PMP4201G; PMP4201Y 2.35 solder lands 0. solder paste solder resist occupied area Dimensions in mm 4.9 2. 1.3 1.3 1.225 1.225 Dimensions in mm Rev. 04 — 28 August 2009 NPN/NPN matched double transistors 2 ...
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... NXP Semiconductors Fig 17. Reflow soldering footprint SOT363 (SC-88) 4.5 Fig 18. Wave soldering footprint SOT363 (SC-88) PMP4201V_G_Y_4 Product data sheet PMP4201V; PMP4201G; PMP4201Y 2.65 1.5 2.35 0 1.8 1.3 1.3 2.45 5.3 Rev. 04 — 28 August 2009 NPN/NPN matched double transistors 0 0 Dimensions in mm 1.5 0.3 2.5 1.5 Dimensions in mm direction during soldering solder lands solder resist ...
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... Document ID Release date PMP4201V_G_Y_4 20090828 • Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. • Figure 14 “Reflow soldering footprint • Figure 16 “Wave soldering footprint SOT353 • ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Application information Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 10 Packing information Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 12 Revision history ...