2PC4081Q /T3 NXP Semiconductors, 2PC4081Q /T3 Datasheet

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NPN general-purpose transistor Rev. 06 — 17 November 2009 1. Product profile 1.1 General description NPN transistor in a SOT323 (SC-70) plastic package. The PNP complement is 2PA1576. 1.2 Features Low current (max. 150 mA) Low voltage (max. 50 ...

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... NXP Semiconductors 4. Marking Table 3. Type number 2PC4081Q 2PC4081R 2PC4081S [ made in Hong Kong * = t: made in Malaysia 5. Limiting values Table 4. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V collector-base voltage CBO V collector-emitter voltage CEO V emitter-base voltage EBO I collector current (DC) ...

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... NXP Semiconductors 7. Characteristics Table 6. ° amb Symbol I CBO I EBO CEsat [1] Pulse test: t 2PC4081_6 Product data sheet Characteristics C unless otherwise specified. Parameter Conditions collector-base cut-off current 150 ° emitter-base ...

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... NXP Semiconductors 8. Package outline Plastic surface-mounted package; 3 leads DIMENSIONS (mm are the original dimensions UNIT max 1.1 0.4 0.25 mm 0.1 0.8 0.3 0.10 OUTLINE VERSION IEC SOT323 Fig 1. Package outline SOT323 (SC-70) 2PC4081_6 Product data sheet scale ...

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... Revision history Document ID Release date 2PC4081_6 20091117 • Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. • Figure 1 “Package outline SOT323 2PC4081_5 20041125 2PC4081_4 ...

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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

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... NXP Semiconductors 12. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 2 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 5 10 Legal information 10.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 6 10.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 10.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 10.4 Trademarks Contact information ...