BCX55-16 /T3 NXP Semiconductors, BCX55-16 /T3 Datasheet
BCX55-16 /T3
Specifications of BCX55-16 /T3
Related parts for BCX55-16 /T3
BCX55-16 /T3 Summary of contents
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... BCP55; BCX55; BC55PA NPN medium power transistors Rev. 8 — 24 October 2011 1. Product profile 1.1 General description NPN medium power transistor series in Surface-Mounted Device (SMD) plastic packages. Table 1. Type number BCP55 BCX55 BC55PA [1] Valid for all available selection groups. 1.2 Features and benefits ...
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... SOT1061 Ordering information Table 4. Type number BCP55 BCX55 BC55PA [1] Valid for all available selection groups. BCP55_BCX55_BC55PA Product data sheet BCP55; BCX55; BC55PA Pinning Description base collector emitter collector emitter collector base base emitter collector Ordering information [1] Package Name ...
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... BCP55-10 BCP55-16 BCX55 BCX55-10 BCX55-16 BC55PA BC55-10PA BC55-16PA BCP55_BCX55_BC55PA Product data sheet BCP55; BCX55; BC55PA Marking codes All information provided in this document is subject to legal disclaimers. Rev. 8 — 24 October 2011 NPN medium power transistors Marking code BCP55 BCP55/10 BCP55/ ...
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... Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint. [5] Device mounted on an FR4 PCB, 4-layer copper, tin-plated, mounting pad for collector 1 cm BCP55_BCX55_BC55PA Product data sheet BCP55; BCX55; BC55PA Limiting values Parameter Conditions collector-base voltage open emitter collector-emitter voltage ...
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... FR4 PCB, single-sided copper, mounting pad for collector 6 cm (3) FR4 PCB, single-sided copper, mounting pad for collector 1 cm (4) FR4 PCB, 4-layer copper, standard footprint (5) FR4 PCB, single-sided copper, standard footprint Fig 3. Power derating curves SOT1061 BCP55_BCX55_BC55PA Product data sheet BCP55; BCX55; BC55PA 006aac674 75 125 175 T (°C) amb ...
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... Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint. [5] Device mounted on an FR4 PCB, 4-layer copper, tin-plated, mounting pad for collector 1 cm BCP55_BCX55_BC55PA Product data sheet BCP55; BCX55; BC55PA Thermal characteristics Parameter Conditions thermal resistance from in free air junction to ambient ...
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... FR4 PCB, mounting pad for collector 1 cm Fig 5. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT223; typical values BCP55_BCX55_BC55PA Product data sheet BCP55; BCX55; BC55PA –3 –2 – –3 –2 – ...
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... FR4 PCB, standard footprint Fig 7. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT89; typical values BCP55_BCX55_BC55PA Product data sheet BCP55; BCX55; BC55PA –3 –2 – –3 –2 – All information provided in this document is subject to legal disclaimers. ...
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... FR4 PCB, mounting pad for collector 6 cm Fig 9. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT89; typical values BCP55_BCX55_BC55PA Product data sheet BCP55; BCX55; BC55PA –3 –2 – –3 –2 –1 10 ...
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... FR4 PCB, single-sided copper, mounting pad for collector 1 cm Fig 11. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061; typical values BCP55_BCX55_BC55PA Product data sheet BCP55; BCX55; BC55PA –3 –2 – –3 –2 –1 ...
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... FR4 PCB, 4-layer copper, standard footprint Fig 13. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061; typical values BCP55_BCX55_BC55PA Product data sheet BCP55; BCX55; BC55PA –3 –2 – –3 –2 – All information provided in this document is subject to legal disclaimers ...
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... Table amb Symbol I CBO I EBO CEsat [1] Pulse test: t BCP55_BCX55_BC55PA Product data sheet BCP55; BCX55; BC55PA –3 –2 – Characteristics C unless otherwise specified. Parameter Conditions collector-base cut-off current 150 C T ...
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... Fig 16. Collector current as a function of 006aac692 (mA) C Fig 18. Collector-emitter saturation voltage as a All information provided in this document is subject to legal disclaimers. Rev. 8 — 24 October 2011 BCP55; BCX55; BC55PA NPN medium power transistors 1.6 I (mA (A) 1.2 0.8 ...
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... This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. 9. Package outline Fig 19. Package outline SOT223 (SC-73) Fig 20. Package outline SOT89 (SC-62/TO-243) BCP55_BCX55_BC55PA Product data sheet BCP55; BCX55; BC55PA 6.7 6.3 3.1 2.9 7.3 3.7 6.7 3 ...
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... BCP55 BCX55 BC55PA [1] For further information and the availability of packing methods, see [2] Valid for all available selection groups. [3] T1: normal taping [4] T3: 90 rotated taping BCP55_BCX55_BC55PA Product data sheet BCP55; BCX55; BC55PA 0.35 0.25 1 1.05 0.95 0.3 0.2 Dimensions in mm Packing methods Package Description [2] SOT223 8 mm pitch tape and reel SOT89 8 mm pitch tape and reel ...
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... All information provided in this document is subject to legal disclaimers. Rev. 8 — 24 October 2011 BCP55; BCX55; BC55PA NPN medium power transistors 6.1 3.9 7.65 6.2 8.7 3 1.9 (3×) solder lands solder resist solder paste occupied area Dimensions in mm sot223_fr solder lands ...
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... NXP Semiconductors 0.85 4.6 Fig 24. Reflow soldering footprint SOT89 (SC-62/TO-243) 7.6 Fig 25. Wave soldering footprint SOT89 (SC-62/TO-243) BCP55_BCX55_BC55PA Product data sheet BCP55; BCX55; BC55PA 4.75 2.25 2 1.9 1.2 0.2 1.2 1 (3×) 1.5 1.5 3.95 6.6 2.4 3.5 0.5 1.8 (2×) 1.9 1.9 1.5 0.7 (2×) 5.3 All information provided in this document is subject to legal disclaimers. Rev. 8 — 24 October 2011 NPN medium power transistors 1 ...
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... NXP Semiconductors Fig 26. Reflow soldering footprint SOT1061 (HUSON3) BCP55_BCX55_BC55PA Product data sheet BCP55; BCX55; BC55PA 1.05 0.6 0.55 2.3 solder paste = solder lands solder resist Reflow soldering is the only recommended soldering method. All information provided in this document is subject to legal disclaimers. Rev. 8 — 24 October 2011 NPN medium power transistors 2 ...
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... BC637_BCP55_BCX55 v.6 20050218 BC635_637_639 v.4 20011010 BCP54_55_56 v.5 20030206 BCX54_55_56 v.4 20011010 BCP55_BCX55_BC55PA Product data sheet BCP55; BCX55; BC55PA Data sheet status Product data sheet • Type number removed: BC637 • Type number added: BC55PA, BC55-10PA and BC55-16PA • Section 1 “Product profile”: updated • ...
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... BCP55_BCX55_BC55PA Product data sheet BCP55; BCX55; BC55PA [3] Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. ...
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... Contact information For more information, please visit: For sales office addresses, please send an email to: BCP55_BCX55_BC55PA Product data sheet BCP55; BCX55; BC55PA 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. http://www.nxp.com salesaddresses@nxp.com All information provided in this document is subject to legal disclaimers. Rev. 8 — ...
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... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Document identifier: BCP55_BCX55_BC55PA All rights reserved. Date of release: 24 October 2011 ...