IS42S16400F-6BLI ISSI, Integrated Silicon Solution Inc, IS42S16400F-6BLI Datasheet - Page 15
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IS42S16400F-6BLI
Manufacturer Part Number
IS42S16400F-6BLI
Description
IC SDRAM 64MBIT 166MHZ 54BGA
Manufacturer
ISSI, Integrated Silicon Solution Inc
Type
SDRAMr
Datasheet
1.IS42S16400F-7TL.pdf
(59 pages)
Specifications of IS42S16400F-6BLI
Format - Memory
RAM
Memory Type
SDRAM
Memory Size
64M (4M x 16)
Speed
166MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
54-BGA
Organization
4Mx16
Density
64Mb
Address Bus
14b
Access Time (max)
6/5.4ns
Maximum Clock Rate
166MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TFBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
140mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
IS42S16400F-6BLI
Manufacturer:
ISSI, Integrated Silicon Solution Inc
Quantity:
10 000
Company:
Part Number:
IS42S16400F-6BLI-TR
Manufacturer:
ISSI, Integrated Silicon Solution Inc
Quantity:
10 000
IS42S16400F
IS45S16400F
AC ELECTRICAL CHARACTERISTICS
Notes:
1. When power is first applied, memory operation should be started 200 µs after V
2. measured with t
3. The reference level is 1.4 V when measuring input signal timing. Rise and fall times are measured between V
4. Access time is measured at 1.4V with the load shown in the figure below.
5. The time t
6. If clock rising time is longer than 1ns, t
Integrated Silicon Solution, Inc. — www.issi.com
Rev. H
07/28/2010
Symbol Parameter
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
ck3
ck2
ac3
ac2
ch
cl
oh3
oh2
lz
hz3
hz2
ds
dh
as
ah
cks
ckh
cka
cms
cmh
rc
ras
rp
rcd
rrd
dpl
wr
dal
t
xsr
ref
note that the power-on sequence must be executed before starting memory operation.
(max.).
when the output is in the high impedance state.
or
Clock Cycle Time
Access Time From CLK
CLK HIGH Level Width
CLK LOW Level Width
Output Data Hold Time
Output LOW Impedance Time
Output HIGH Impedance Time
Input Data Setup Time
Input Data Hold Time
Address Setup Time
Address Hold Time
CKE Setup Time
CKE Hold Time
CKE to CLK Recovery Delay Time
Command Setup Time (CS, RAS, CAS, WE, DQM)
Command Hold Time (CS, RAS, CAS, WE, DQM)
Command Period (REF to REF / ACT to ACT)
Command Period (ACT to PRE)
Command Period (PRE to ACT)
Active Command To Read / Write Command Delay Time
Command Period (ACT [0] to ACT[1])
Input Data To Precharge
Command Delay time
Input Data To Active / Refresh
Command Delay time
(During Auto-Precharge)
Transition Time
Exit to Self-Refresh to Active Time
Refresh Cycle Time (4096)
hz
(max.) is defined as the time required for the output voltage to transition by ± 200 mV from V
t
= 1 ns.
T
a
(6)
(4,6)
≤ 70
T
o
a
C Com., Ind., A1, A2
(5)
≤ 85
t
/
CAS Latency = 3
CAS Latency = 2
CAS Latency = 3
CAS Latency = 2
CAS Latency = 3
CAS Latency = 2
CAS Latency = 3
CAS Latency = 2
CAS Latency = 3
CAS Latency = 2
CAS Latency = 3
CAS Latency = 2
2
o
C Ind., A1, A2
T
- 0.5ns should be added to the parameter.
a
> 85
o
C
(1,2,3)
A2
2CLK+t
2CLK+t
1CLK+3
2CLK
2CLK
Min.
7.5
2.5
2.5
1.5
0.8
1.5
0.8
1.5
0.8
1.5
0.8
0.3
55
40
15
15
10
60
—
—
—
—
—
—
—
5
2
2
0
rp
rp
-5
100,000
Max.
1.2
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
64
64
—
5
6
5
6
dd
and V
2CLK+t
2CLK+t
1CLK+3
2CLK
2CLK
Min.
7.5
2.5
2.5
1.5
0.8
1.5
0.8
1.5
0.8
1.5
0.8
0.3
—
—
—
—
60
42
18
18
12
66
—
—
—
6
2
2
0
ddq
-6
rp
rp
100,000
reach their stipulated voltages. Also
Max.
5.4
5.4
1.2
64
64
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
6
6
2CLK+t
2CLK+t
1CLK+3
2CLK
2CLK
Min.
2.5
2.5
0.8
1.5
0.8
0.8
0.3
7.5
2.7
2.7
1.5
0.8
1.5
1.5
oh
63
42
20
20
14
70
—
—
—
—
—
—
—
7
0
(min.) or V
-7
rp
rp
ih
(min.) and V
100,000
Max.
5.4
5.4
1.2
64
64
16
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
6
6
ol
(max.)
Units
il
ms
ms
ms
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
15