IS61LV6416-10TLI ISSI, Integrated Silicon Solution Inc, IS61LV6416-10TLI Datasheet - Page 13

• Manufacturer Part Number: IS61LV6416-10TLI
• Description: IC SRAM 1MBIT 10NS 44TSOP
• Manufacturer: ISSI, Integrated Silicon Solution Inc

Specifications of IS61LV6416-10TLI

• Format - Memory: RAM
• Memory Type: SRAM - Asynchronous
• Memory Size: 1M (64K x 16)
• Speed: 10ns
• Interface: Parallel
• Voltage - Supply: 3.135 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-TSOP II
• Density: 1Mb
• Access Time (max): 10ns
• Sync/async: Asynchronous
• Architecture: Not Required
• Clock Freq (max): Not RequiredMHz
• Operating Supply Voltage (typ): 3.3V
• Address Bus: 16b
• Package Type: TSOP-II
• Operating Temp Range: -40C to 85C
• Number Of Ports: 1
• Supply Current: 130mA
• Operating Supply Voltage (min): 3.135V
• Operating Supply Voltage (max): 3.63V
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 44
• Word Size: 16b
• Number Of Words: 64K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

400-mil Plastic SOJ
Package Code: K
PACKAGING INFORMATION
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com —
Rev. F
10/29/03
No. Leads (N)
Symbol
A1
A2
E1
E2
N
A
B
C
D
E
b
e
1
Min
Millimeters
18.29 18.54
11.05 11.30
10.03 10.29
3.25
0.64
2.08
0.38
0.66
0.18
1.27 BSC
9.40 BSC
e
Max
3.75
0.51
0.81
0.33
—
—
28
D
Min
0.128 0.148
0.025
0.082
0.015 0.020
0.026 0.032
0.007 0.013
0.720 0.730
0.435 0.445
0.395 0.405
Inches
0.370 BSC
0.050 BSC
Max
—
—
B
N/2
N/2+1
b
20.82 21.08
10.03 10.29
11.05 11.30
Min
Millimeters
3.25
0.64
2.08
0.38
0.66
0.18
1.27 BSC
9.40 BSC
A
E1
A1
Max
1-800-379-4774
—
—
3.75
0.51
0.81
0.33
32
E
Min
0.128 0.148
0.025
0.082
0.015 0.020
0.026 0.032
0.007 0.013
0.820 0.830
0.435 0.445
0.395 0.405
Inches
0.370 BSC
0.050 BSC
SEATING PLANE
Max
—
—
23.37 23.62
11.05 11.30
10.03 10.29
Min
Millimeters
3.25
0.64
2.08
0.38
0.66
0.18
1.27 BSC
9.40 BSC
E2
Notes:
1. Controlling dimension:
2. BSC = Basic lead spacing
3. Dimensions D and E1 do not
4. Reference document: JEDEC
MS-027.
millimeters.
between centers.
the bottom of the package.
and should be measured from
include mold flash protrusions
Max
3.75
0.51
0.81
0.33
—
—
ISSI
36
Min
0.128 0.148
0.025
0.082
0.015 0.020
0.026 0.032
0.007 0.013
0.920 0.930
0.435 0.445
0.395 0.405
0.370 BSC
0.050 BSC
Inches
C
Max
A2
—
—
®