BUK963R2-40B /T3 NXP Semiconductors, BUK963R2-40B /T3 Datasheet - Page 7

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BUK963R2-40B /T3

Manufacturer Part Number
BUK963R2-40B /T3
Description
MOSFET HIGH PERF TRENCHMOS
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BUK963R2-40B /T3

Product Category
MOSFET
Rohs
yes
Transistor Polarity
N-Channel
Drain-source Breakdown Voltage
40 V
Gate-source Breakdown Voltage
+/- 15 V
Continuous Drain Current
222 A
Resistance Drain-source Rds (on)
0.0028 Ohms
Configuration
Single
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Package / Case
SOT-404
Fall Time
192 ns
Minimum Operating Temperature
- 55 C
Power Dissipation
300 W
Rise Time
268 ns
Factory Pack Quantity
800
Typical Turn-off Delay Time
257 ns
Part # Aliases
BUK963R2-40B,118
NXP Semiconductors
BUK963R2-40B
Product data sheet
Fig 9.
Fig 11. Drain-source on-state resistance as a function
R
(mΩ)
(A)
DSon
I
D
100
75
50
25
0
8
6
4
2
function of gate-source voltage; typical values
of drain current; typical values
Transfer characteristics: drain current as a
0
0
2.8
70
3
3.2
1
140
T
j
= 175 °C
3.4
3.6
210
Label is V
2
3.8
V
280
T
All information provided in this document is subject to legal disclaimers.
GS
j
= 25 °C
GS
4
I
(V)
D
03nh54
03nh57
(V)
(A)
5
10
Rev. 5 — 16 February 2011
350
3
Fig 10. Gate-source threshold voltage as a function of
Fig 12. Normalized drain-source on-state resistance
V
GS(th)
(V)
a
2.5
2.0
1.5
1.0
0.5
1.5
0.5
0
2
1
0
−60
−60
junction temperature
factor as a function of junction temperature
N-channel TrenchMOS logic level FET
0
0
BUK963R2-40B
60
60
max
min
typ
120
120
© NXP B.V. 2011. All rights reserved.
T
T
j
j
(°C)
( ° C)
03ng52
03aa27
180
180
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