MA330026 Microchip Technology, MA330026 Datasheet - Page 301

• Manufacturer Part Number: MA330026
• Description: Daughter Cards & OEM Boards dsPIC33FJ16MC102 Plug-In Module
• Manufacturer: Microchip Technology

Specifications of MA330026

• Rohs: yes
• Product: Plug-In Modules
• Core: PIC
• Data Bus Width: 16 bit
• Description/function: dsPIC33F MC 28 Pin QFN to 100 Pin Plug-in-Module
• Interface Type: I2C, SPI, UART
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 3 V to 3.6 V
• For Use With: DM330021, DM330022, DM330023

© 2011 Microchip Technology Inc.
28-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
NOTE 1
A1
Note:
dsPIC33FJ16GP101/102 AND dsPIC33FJ16MC101/102
A
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
N
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1
2
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
3
b
b1
D
Dimension Limits
Preliminary
Units
A2
A1
E1
eB
b1
N
A
E
D
e
L
c
b
e
1.345
.120
.015
.290
.240
.110
.008
.040
.014
A2
MIN
E1
–
–
L
.100 BSC
INCHES
1.365
NOM
.135
.310
.285
.130
.010
.050
.018
28
–
–
–
Microchip Technology Drawing C04-070B
eB
E
1.400
MAX
.200
.150
.335
.295
.150
.015
.070
.022
.430
–
DS70652C-page 301
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