DS3231MZEVKIT# Maxim Integrated, DS3231MZEVKIT# Datasheet - Page 6

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DS3231MZEVKIT#

Manufacturer Part Number
DS3231MZEVKIT#
Description
Clock & Timer Development Tools Evaluation kit for t he +/-5ppm, I2C Real
Manufacturer
Maxim Integrated
Datasheet

Specifications of DS3231MZEVKIT#

Rohs
yes
Part # Aliases
90-3231M#KZT
Accurate MEMS Real-Time Clocks Product Guide
Benefits of MEMS Technology in RTC Applications
Environmental and Manufacturing Ruggedness
Maxim Integrated’s MEMS-based RTC products have proven, demonstrable performance advantages based on environmental
criteria and observation. In reflow operations that replicate customer attachment, MEMS devices demonstrate frequency shifts
of less than ±1ppm (Figures 1a and 1b). Crystal-based products that face the same regimen of reflow temperature exposure
demonstrate shifts as high as ±5ppm. One of the most important criteria for establishing how well a device operates is its
frequency performance prior to attachment to a motherboard compared to its performance after this attachment process. The
attachment process can have temperature excursions as high as +260°C for several seconds and be above +200°C for several
10s of seconds. Dependable frequency performance over the life of the device is the most important criteria for choosing accurate
timekeeping products. Maxim Integrated MEMS RTCs guarantee ±5ppm frequency accuracy and stability regardless of voltage,
time (aging), or temperature.
Additionally, MEMS-based RTCs have demonstrable shock and vibration performance and have passed AEC-Q100 qualification,
making them one of the most rugged, dependable, and accurate solutions in the industry.
Benefits
• Higher manufacturing temperature processes (+260°C reflows, < 1ppm frequency shifts, fully RoHS)
• Significantly higher shock and vibration capability (> 50g)
• Wide operational temperature environments (-40°C to +85°C)
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Figure 1a. DS3231M Pre-reflow
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1Hz FREQUENCY ERROR TESTED WITH MULTIPLE DS3231M DEVICES
TEMPERATURE (°C)
0
performance
Actual
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specification
DS3231M
limits
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Figure 1b. DS3231M Post-reflow
TEMPERATURE (°C)
performance
Actual
www.maximintegrated.com
specification
DS3231M
limits

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