DS3231MZEVKIT# Maxim Integrated, DS3231MZEVKIT# Datasheet - Page 4

• Manufacturer Part Number: DS3231MZEVKIT#
• Description: Clock & Timer Development Tools Evaluation kit for t he +/-5ppm, I2C Real
• Manufacturer: Maxim Integrated

Specifications of DS3231MZEVKIT#

• Rohs: yes
• Part # Aliases: 90-3231M#KZT

Accurate MEMS Real-Time Clocks Product Guide
Accurate MEMS RTCs at a Glance
Industry's Single Most Integrated Solutions for Accurate Timekeeping
Maxim Integrated embarked on a goal to create a quantum leap in technology advancement by developing an RTC that would
exceed performance in a smaller package, with lower cost, higher accuracy standards, and be substantially more rugged for use in
power meters, video surveillance, and automotive, industrial, and medical applications. The culmination of this work is a product
family based on the MEMS technology: the DS3231M and DS3232M.
DS3231M
The DS3231M is the first temperature-compensated RTC with an internal MEMS resonator to reduce crystal mechanical failure.
Designed to be footprint and functionally compatible to the popular DS3231S, the DS3231M replicates the 16-pin, 300-mil SO for
users looking for a less-expensive solution but want the same functionally, firmware, and board layout found with the DS3231S.
The DS3231M integrates several important system features—resonator, RTC, TXCO, digital temperature sensor, and automatic
power switching—to support battery-backed applications in one device.
DS3232M
The DS3232M is an RTC that adds memory in the smallest package with 236 bytes of battery-backed user memory. The
DS3232M is a MEMS-equivalent to the popular
miniature MEMS resonator in the 8-pin, 150-mil package versus the 20-pin, 300-mil SO of the DS3232S.
From Crystals to MEMS
MEMS technology, because of its size, enables significant space savings when compared to cylindrical crystals. A single MEMS
resonator occupies 47 times less area and 182 times less volume than a cylindrical crystal. This size differential allows for smaller
packaging options, provides significantly enhanced ruggedness in high vibration and shock environments, and demonstrates little
to no aging (< ±1ppm total) over the life of the device.
Simpler Assembly
• Standard IC plastic packaging
• Wire-bonding vs. welding
• Ultrasonic cleaning
• Facilitates large-scale assembly
4
operations
Smaller Packaging
• 8-pin (150 mil) vs. 16-pin (300 mil)
• Chip-scale packaging (CSP) possible
MEMS DIE
CRYSTAL BLANK
CYLINDRICAL CRYSTAL
DS3232S
crystal-based RTC. Major space-saving gains are made with this
Lower Cost
• No special/custom crystals required
• Lower cost MEMS resonator
• Lower cost packaging
www.maximintegrated.com