AT24C256C-XHL-B Atmel, AT24C256C-XHL-B Datasheet - Page 18
![IC EEPROM 256KBIT IND 8TSSOP](/photos/6/83/68331/453-8-tssop_sml.jpg)
AT24C256C-XHL-B
Manufacturer Part Number
AT24C256C-XHL-B
Description
IC EEPROM 256KBIT IND 8TSSOP
Manufacturer
Atmel
Datasheet
1.AT24C256C-SSHL-B.pdf
(22 pages)
Specifications of AT24C256C-XHL-B
Format - Memory
EEPROMs - Serial
Memory Type
EEPROM
Memory Size
256K (32K x 8)
Speed
400kHz, 1MHz
Interface
I²C, 2-Wire Serial
Voltage - Supply
1.7 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-TSSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AT24C256C-XHL-B
Manufacturer:
ATMEL
Quantity:
504
18
8A2 – TSSOP
Atmel AT24C256C
Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions,
packagedrawings@atmel.com
Package Drawing Contact:
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess
5. Dimension D and E1 to be determined at Datum Plane H.
Top View
Side View
Pin 1 indicator
tolerances, datums, etc.
not exceed 0.15 mm (0.006 in) per side.
0.25 mm (0.010 in) per side.
of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot.
Minimum space between protrusion and adjacent lead is 0.07 mm.
3
this corner
D
b
2
e
1
N
A2
E1
A
TITLE
8A2, 8-lead 4.4mm Body, Plastic Thin
Shrink Small Outline Package (TSSOP)
E
SYMBOL
D
E
E1
A
A2
b
e
L
L1
End View
2.90
4.30
0.80
0.19
0.45
COMMON DIMENSIONS
MIN
(Unit of Measure = mm)
–
L
L1
6.40 BSC
0.65 BSC
1.00 REF
NOM
3.00
4.40
1.00
0.60
GPC
–
–
TNR
MAX
3.10
4.50
1.20
1.05
0.30
0.75
DRAWING NO.
8A2
NOTE
2, 5
3, 5
4
8568C–SEEPR–5/10
5/19/10
REV.
E