PSMN009-100B /T3 NXP Semiconductors, PSMN009-100B /T3 Datasheet - Page 8

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PSMN009-100B /T3

Manufacturer Part Number
PSMN009-100B /T3
Description
MOSFET TAPE13 PWR-MOS
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PSMN009-100B /T3

Product Category
MOSFET
Rohs
yes
Transistor Polarity
N-Channel
Drain-source Breakdown Voltage
100 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
75 A
Resistance Drain-source Rds (on)
0.0088 Ohms
Configuration
Single
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Package / Case
SOT-404
Fall Time
43 ns
Minimum Operating Temperature
- 55 C
Power Dissipation
230 W
Rise Time
59 ns
Factory Pack Quantity
800
Typical Turn-off Delay Time
120 ns
Part # Aliases
PSMN009-100B,118
NXP Semiconductors
PSMN009-100B_2
Product data sheet
Fig 9.
Fig 11. Gate-source voltage as a function of gate
R
V
(mΩ)
(V)
GS
DSon
12.5
10
15
7.5
10
8
6
4
2
0
5
of drain current; typical values
charge; typical values
Drain-source on-state resistance as a function
0
0
5 V
50
50
100
100
5.5 V
150
150
V
10 V
GS
Q
I
G
D
= 6 V
(nC)
(A)
03ai03
03ai08
20 V
8 V
200
200
Rev. 02 — 6 July 2009
N-channel TrenchMOS SiliconMAX standard level FET
Fig 10. Normalized drain-source on-state resistance
Fig 12. Input, output and reverse transfer capacitances
(pF)
C
10
10
10
10
a
5
4
3
2
3
2
1
0
10
-60
factor as a function of junction temperature
as a function of drain-source voltage; typical
values
−1
0
1
PSMN009-100B
60
10
120
© NXP B.V. 2009. All rights reserved.
V
DS
03aa29
T
j
( ° C)
(V)
C
C
03ai07
C
iss
oss
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180
10
2
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