BSH103 /T3 NXP Semiconductors, BSH103 /T3 Datasheet - Page 4

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BSH103 /T3

Manufacturer Part Number
BSH103 /T3
Description
MOSFET TAPE13 MOSFET
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BSH103 /T3

Product Category
MOSFET
Rohs
yes
Transistor Polarity
N-Channel
Drain-source Breakdown Voltage
30 V
Gate-source Breakdown Voltage
+/- 8 V
Continuous Drain Current
0.85 A
Configuration
Single
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Package / Case
SOT-23
Fall Time
3.5 ns
Minimum Operating Temperature
- 55 C
Power Dissipation
500 mW
Rise Time
3.5 ns
Factory Pack Quantity
10000
Typical Turn-off Delay Time
20 ns
Part # Aliases
BSH103,235
Philips Semiconductors
THERMAL CHARACTERISTICS
1998 Feb 11
handbook, full pagewidth
R
SYMBOL
th j-s
N-channel enhancement mode
MOS transistor
Fig.4
R th j-s
(K/W)
10
10
10
10
1
3
2
Transient thermal resistance from junction to soldering point as a function of pulse time; typical values.
6
thermal resistance from junction to soldering point
0.75
0.33
0.05
0.02
0.01
= 1
0.5
0.2
0.1
10
0
5
10
PARAMETER
4
10
4
3
10
2
P
10
t p
VALUE
1
140
T
Product specification
t p (s)
=
t p
T
t
BSH103
MBK503
UNIT
1
K/W

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