ZXGD3104N8TC Diodes Inc. / Zetex, ZXGD3104N8TC Datasheet - Page 3

• Manufacturer Part Number: ZXGD3104N8TC
• Description: MOSFET Synch MOSFET Control SO-8 T&R 2.5K
• Manufacturer: Diodes Inc. / Zetex

Specifications of ZXGD3104N8TC

• Rohs: yes

Thermal Characteristics
Maximum Ratings
Supply voltage, relative to GND
Drain pin voltage
Gate output voltage
Gate Driver peak source current
Gate Driver peak sink current
Reference voltage
Reference current
Bias voltage
Bias current
Power Dissipation
Linear derating factor
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Lead
Operating Temperature Range
Storage Temperature Range
Notes:
ZXGD3104N8
Document Number DS35546
4. For a device surface mounted on minimum recommended pad layout FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the
5. Same as note (4), except pin 5 (V
6. Same as note (5), except both heatsinks are 10mm x 10mm.
7. Same as note (5), except both heatsinks are 15mm x 15mm.
8. Thermal resistance from junction to solder-point at the end of each lead on pin 5 (V
device is measured when operating in a steady-state condition.
Rev. 1 – 2
Characteristic
Characteristic
@T
A
= 25°C unless otherwise specified
@T
CC
A
= 25°C unless otherwise specified
) and pin 6 (GND) are both connected to separate 5mm x 5mm 1oz copper heatsinks.
(Note 4)
(Note 5)
(Note 6)
(Note 7)
(Note 4)
(Note 5)
(Note 6)
(Note 7)
(Note 8)
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Symbol
Symbol
I
SOURCE
T
V
V
R
R
I
I
V
I
V
V
SINK
BIAS
P
REF
T
STG
BIAS
REF
θJA
θJL
CC
D
G
J
D
CC
) and pin 6 (GND).
Diodes Incorporated
A Product Line of
-3 to V
-40 to +150
-50 to +150
-3 to 180
Value
Value
100
V
490
3.92
655
5.24
720
5.76
785
6.28
255
191
173
159
135
2.5
V
25
25
7
CC
CC
CC
+ 3
ZXGD3104N8
© Diodes Incorporated
November 2011
mW/°C
°C/W
°C/W
Unit
Unit
mW
mA
mA
°C
V
V
V
A
A
V
V