AT24C128B-TH-T Atmel, AT24C128B-TH-T Datasheet - Page 12

• Manufacturer Part Number: AT24C128B-TH-T
• Description: IC EEPROM 128KBIT 1MHZ 8TSSOP
• Manufacturer: Atmel

Specifications of AT24C128B-TH-T

• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Memory Size: 128K (16K x 8)
• Speed: 400kHz, 1MHz
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-TSSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

10. AT24C128B Ordering Information
Notes:
12
Ordering Code
AT24C128B-PU (Bulk Form Only)
AT24C128BN-SH-B
AT24C128BN-SH-T
AT24C128B-TH-B
AT24C128B-TH-T
AT24C128BY6-YH-T
AT24C128BD3-DH-T
AT24C128BU2-UU-T
AT24C128B-W-11
8P3
8S1
8A2
8Y6
8D3
8U2-1
−1.8
1. “-B” denotes bulk.
2. “-T” denotes and tape and reel. SOIC = 4K. TSSOP, dBGA2, and Mini MAP = 5k. SAP = 3K.
3. Available in tape and reel and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request. Please
AT24C128B
contact Serial Interface Marketing.
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)
8-lead, 2.00 mm x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini MAP, Dual No Lead Package, (DFN), (MLP2x3mm)
8-lead, 1.80 mm x 2.20 mm Body, Ultra Lead Frame Land Grid Array (ULA)
8-ball, die Ball Grid Array Package (dBGA2)
Low-voltage (1.8V to 5.5V)
(1)
(2)
(3)
(2)
(1)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(2)
(2)
(2)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
Package Type
Options
Voltage
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
Package
Die Sale
8U2-1
8S1
8S1
8A2
8D3
8P3
8A2
8Y6
Lead-free/Halogen-free
Industrial Temperature
Industrial Temperature
Operation Range
(−40°C to 85°C)
(−40°C to 85°C)
5296A–SEEPR–1/08