SIHB30N60E-GE3 Vishay/Siliconix, SIHB30N60E-GE3 Datasheet - Page 4

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SIHB30N60E-GE3

Manufacturer Part Number
SIHB30N60E-GE3
Description
MOSFET 600V 125mOhm@10V 29A N-Ch E-SRS
Manufacturer
Vishay/Siliconix
Datasheet

Specifications of SIHB30N60E-GE3

Product Category
MOSFET
Rohs
yes
Transistor Polarity
N-Channel
Drain-source Breakdown Voltage
600 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
29 A
Resistance Drain-source Rds (on)
125 mOhms at 10 V
Configuration
Single
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Package / Case
D2PAK (TO-263)
Fall Time
36 ns
Forward Transconductance Gfs (max / Min)
5.4 S
Gate Charge Qg
85 nC
Minimum Operating Temperature
- 55 C
Power Dissipation
250 W
Rise Time
32 ns
Typical Turn-off Delay Time
63 ns
S12-3103-Rev. E, 24-Dec-12
1000
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
100
0.1
0.001
10
1000
0.01
100
1
0.1
Fig. 7 - Typical Source-Drain Diode Forward Voltage
10
0.1
0.01
1
0.1
* V
0.0
0.0001
1
Fig. 8 - Maximum Safe Operating Area
T
T
Single Pulse
GS
C
J
= 150 °C
= 25 °C
> minimum V
www.vishay.com
0.2
Operation in this area
limited by R
V
0.2
0.1
Single Pulse
Duty Cycle = 0.5
0.05
0.02
DS
T
1
, Drain-to-Source Voltage (V)
J
V
0.4
= 150 °C
SD
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
- Source-to-Drain Voltage (V)
GS
0.6
DS(on)
at which R
10
Fig. 11 - Normalized Thermal Transient Impedance, Junction-to-Case
0.8
BVDSS Limited
T
J
0.001
I
1.0
DS(on)
DM
= 25 °C
100
For technical questions, contact:
Limited
is specified
1.2
1.4
1000
1 ms
10 ms
100 μs
Square Wave Pulse Duration (s)
1.6
4
0.01
hvm@vishay.com
30.0
25.0
20.0
15.0
10.0
5.0
0
Fig. 9 - Maximum Drain Current vs. Case Temperature
25
Fig. 10 - Temperature vs. Drain-to-Source Voltage
www.vishay.com/doc?91000
50
0.1
T
T
C
J
- Temperature (°C)
- Temperature (°C)
75
100
Vishay Siliconix
SiHB30N60E
Document Number: 91453
125
1
150

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