AT93C46E-TH-B Atmel, AT93C46E-TH-B Datasheet - Page 15
![IC EEPROM 1KBIT 2MHZ 8TSSOP](/photos/6/83/68331/453-8-tssop_sml.jpg)
AT93C46E-TH-B
Manufacturer Part Number
AT93C46E-TH-B
Description
IC EEPROM 1KBIT 2MHZ 8TSSOP
Manufacturer
Atmel
Specifications of AT93C46E-TH-B
Format - Memory
EEPROMs - Serial
Memory Type
EEPROM
Memory Size
1K (64 x 16)
Speed
250kHz, 1MHz, 2MHz
Interface
3-Wire Serial
Voltage - Supply
1.8 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-TSSOP
Organization
64 x 16
Interface Type
3-Wire
Maximum Clock Frequency
2 MHz
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.8 V
Maximum Operating Current
2 mA
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Operating Supply Voltage
2.5 V, 3.3 V, 5 V
Capacitance, Input
5 pF
Capacitance, Output
5 pF
Current, Input, Leakage
0.1 μA
Current, Operating
0.5 mA
Current, Output, Leakage
0.1
Data Retention
100 yrs.
Density
1K
Package Type
TSSOP
Temperature, Operating
-40 to +85 °C
Time, Address Setup
200
Time, Fall
1000 ns
Time, Rise
1000 ns
Voltage, Input, High
2.3 to 6 V
Voltage, Input, Low
0.54 to 1.65 V
Voltage, Output, High
1.6 to 5.3 V
Voltage, Output, Low
0.2 V
Voltage, Supply
1.8 to 5.5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AT93C46E-TH-B
Manufacturer:
L-COM
Quantity:
30
Part Number:
AT93C46E-TH-B
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
8A2 - TSSOP
5207D–SEEPR–1/08
Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances,
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the
5. Dimension D and E1 to be determined at Datum Plane H.
Package Drawing Contact:
packagedrawings@atmel.com
datums, etc.
0.15 mm (0.006 in) per side.
(0.010 in) per side.
b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between
protrusion and adjacent lead is 0.07 mm.
Top View
Side View
Pin 1 indicator
3
this corner
D
b
2
e
1
N
A2
E1
TITLE
8A2, 8-lead, 4.4mm Body, Plastic Thin
Shrink Small Outline Package (TSSOP)
A
E
SYMBOL
D
E
E1
A
A2
b
e
L
L1
End View
2.90
4.30
0.80
0.19
0.45
COMMON DIMENSIONS
MIN
(Unit of Measure = mm)
–
L
L1
GPC
6.40 BSC
0.65 BSC
1.00 RE3
TNR
NOM
3.00
4.40
1.00
0.60
–
–
DRAWING NO.
MAX
3.10
4.50
1.20
1.05
0.30
0.75
AT93C46E
8A2
NOTE
2, 5
3, 5
4
10/29/08
REV.
C
15