AT24C01BN-SH-T Atmel, AT24C01BN-SH-T Datasheet - Page 23

• Manufacturer Part Number: AT24C01BN-SH-T
• Description: IC EEPROM 1KBIT 1MHZ 8SOIC
• Manufacturer: Atmel

Specifications of AT24C01BN-SH-T

• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Memory Size: 1K (128 x 8)
• Speed: 400kHz, 1MHz
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (3.9mm Width)
• Organization: 128 K x 8
• Interface Type: 2-Wire
• Maximum Clock Frequency: 1 MHz
• Access Time: 550 ns
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.8 V
• Maximum Operating Current: 3 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 2.5 V, 3.3 V, 5 V
• Capacitance, Input: 6 pF
• Capacitance, Output: 8 pF
• Current, Input, Leakage: 0.1 μA
• Current, Operating: 0.4 mA (Read), 2 mA (Write)
• Current, Output, Leakage: 0.05
• Data Retention: 100 yrs.
• Density: 1K
• Package Type: JEDEC SOIC
• Temperature, Operating: -40 to +85 °C
• Time, Access: 0.55 μs
• Time, Fall: 300 ns
• Time, Rise: 0.3 μs
• Voltage, Input, High: 2.3 to 6 V
• Voltage, Input, Low: 0.54 to 1.65 V
• Voltage, Output, Low: 0.2 V
• Voltage, Supply: 1.8 to 5.5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

13. 8U3-1 – dBGA2
5156E–SEEPR–10/08
(e1)
1. Dimension “b” is measured at the maximum solder ball diameter.
This drawing is for general information only.
(d1)
R
d
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
1
8
PIN 1 BALL PAD CORNER
PIN 1 BALL PAD CORNER
e
Bottom View
8 SOLDER BALLS
2
7
Top View
E
3
6
TITLE
8U3-1, 8-ball, 1.50 x 2.00 mm Body, 0.50 mm pitch,
Small Die Ball Grid Array Package (dBGA2)
4
5
D
A
2
SYMBOL
A
A1
A2
b
D
E
e
e1
d
d1
Side View
COMMON DIMENSIONS
MIN
0.71
0.10
0.40
0.20
A
(Unit of Measure = mm)
1.50 BSC
2.00 BSC
0.50 BSC
1.00 BSC
0.25 REF
0.25 REF
NOM
0.81
0.15
0.45
0.25
DRAWING NO.
A
1
PO8U3-1
MAX
0.91
0.20
0.50
0.30
1.
b
NOTE
6/24/03
REV.
A
23