AT24C01BN-SH-T Atmel, AT24C01BN-SH-T Datasheet - Page 21

IC EEPROM 1KBIT 1MHZ 8SOIC

AT24C01BN-SH-T

Manufacturer Part Number
AT24C01BN-SH-T
Description
IC EEPROM 1KBIT 1MHZ 8SOIC
Manufacturer
Atmel
Datasheets

Specifications of AT24C01BN-SH-T

Format - Memory
EEPROMs - Serial
Memory Type
EEPROM
Memory Size
1K (128 x 8)
Speed
400kHz, 1MHz
Interface
I²C, 2-Wire Serial
Voltage - Supply
1.8 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-SOIC (3.9mm Width)
Organization
128 K x 8
Interface Type
2-Wire
Maximum Clock Frequency
1 MHz
Access Time
550 ns
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.8 V
Maximum Operating Current
3 mA
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Operating Supply Voltage
2.5 V, 3.3 V, 5 V
Capacitance, Input
6 pF
Capacitance, Output
8 pF
Current, Input, Leakage
0.1 μA
Current, Operating
0.4 mA (Read), 2 mA (Write)
Current, Output, Leakage
0.05
Data Retention
100 yrs.
Density
1K
Package Type
JEDEC SOIC
Temperature, Operating
-40 to +85 °C
Time, Access
0.55 μs
Time, Fall
300 ns
Time, Rise
0.3 μs
Voltage, Input, High
2.3 to 6 V
Voltage, Input, Low
0.54 to 1.65 V
Voltage, Output, Low
0.2 V
Voltage, Supply
1.8 to 5.5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AT24C01BN-SH-T
Manufacturer:
IR
Quantity:
1 001
Part Number:
AT24C01BN-SH-T
Manufacturer:
ATMEL
Quantity:
120
Part Number:
AT24C01BN-SH-T
Manufacturer:
ATMEL/爱特梅尔
Quantity:
20 000
11. 8Y6 - Mini Map
5156E–SEEPR–10/08
Notes:
R
2325 Orchard Parkway
San Jose, CA 95131
3. Soldering the large thermal pad is optional, but not recommended. No electrical connection is accomplished to the
1. This drawing is for general information only. Refer to JEDEC Drawing MO-229, for proper dimensions,
2. Dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. If the
tolerances, datums, etc.
terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area.
device through this pad, so if soldered it should be tied to ground
D
Pin 1
Pin 1
Index
Index
Area
Area
TITLE
8Y6, 8-lead 2.0 x 3.0 mm Body, 0.50 mm Pitch, Utlra Thin Mini-Map,
Dual No Lead Package (DFN) ,(MLP 2x3)
A3
A3
A2
A2
A
A1
A1
SYMBOL
E2
A
A3
e
D
E
D2
A1
A2
L
b
COMMON DIMENSIONS
1.40
0.20
0.20
MIN
0.0
(Unit of Measure = mm)
-
-
-
1.50 REF.
1.50 REF.
e (6X)
e (6X)
D2 D2
2.00 BSC
3.00 BSC
0.50 BSC
0.20 REF
NOM
1.50
0.02
0.30
0.25
-
-
-
MAX
1.60
1.40
0.60
0.05
0.55
0.40
0.30
DRAWING NO.
8Y6
NOTE
(8X)
(8X)
2
Pin 1 ID
Pin 1 ID
b
L (8X)
L (8X)
10/16/07
REV.
D
21

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