W25X20BVSNIG Winbond Electronics, W25X20BVSNIG Datasheet - Page 36

• Manufacturer Part Number: W25X20BVSNIG
• Description: IC SPI FLASH 2MBIT 8SOIC
• Manufacturer: Winbond Electronics

Specifications of W25X20BVSNIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 2M (256K x 8)
• Speed: 104MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (3.9mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

W25X10BV/20BV/40BV
9.2.23 JEDEC ID (9Fh)
For compatibility reasons, the W25X10BV/20BV/40BV provides several instructions to electronically
determine the identity of the device. The Read JEDEC ID instruction is compatible with the JEDEC
standard for SPI compatible serial memories that was adopted in 2003.
The instruction is initiated by driving the /CS pin low and shifting the instruction code “9Fh”. The
JEDEC assigned Manufacturer ID byte for Winbond (EFh) and two Device ID bytes, Memory Type
(ID15-ID8) and Capacity (ID7-ID0) are then shifted out on the falling edge of CLK with most significant
bit (MSB) first as shown in figure 24. For memory type and capacity values refer to Manufacturer and
Device Identification table.
Figure 24. Read JEDEC ID
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