CY7C1363C-133AXC Cypress Semiconductor Corp, CY7C1363C-133AXC Datasheet - Page 33

• Manufacturer Part Number: CY7C1363C-133AXC
• Description: IC SRAM 9MBIT 133MHZ 100LQFP
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY7C1363C-133AXC

• Memory Size: 9M (512K x 18)
• Format - Memory: RAM
• Memory Type: SRAM - Synchronous
• Speed: 133MHz
• Interface: Parallel
• Voltage - Supply: 3.135 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 100-LQFP
• Memory Configuration: 512K X 18 / 256K X 36
• Clock Frequency: 133MHz
• Access Time: 6.5ns
• Supply Voltage Range: 3.135V To 3.6V
• Memory Case Style: TQFP
• No. Of Pins: 100
• Density: 9Mb
• Access Time (max): 6.5ns
• Sync/async: Synchronous
• Architecture: SDR
• Clock Freq (max): 133MHz
• Operating Supply Voltage (typ): 3.3V
• Address Bus: 19b
• Package Type: TQFP
• Operating Temp Range: 0C to 70C
• Number Of Ports: 2
• Supply Current: 250mA
• Operating Supply Voltage (min): 3.135V
• Operating Supply Voltage (max): 3.6V
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 100
• Word Size: 18b
• Number Of Words: 512K
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 428-2131; CY7C1363C-133AXC

Document History Page
Document Number: 38-05541 Rev. *J
Document Title: CY7C1361C/CY7C1363C 9-Mbit (256 K × 36/512 K × 18) Flow-through SRAM
Document Number: 38-05541
REV.
*C
*D
*G
*H
*A
*B
*E
*F
*J
**
*I
ECN NO.
2756340
3036754
3050869
3096309
241690
278969
332059
377095
408298
433033
501793
Submission
08/26/2009
09/23/2010
10/07/2010
11/28/2010
See ECN
See ECN
See ECN
See ECN
See ECN
See ECN
See ECN
Date
VKN/AESA Updated template
Change
Orig. of
RKF
RKF
RXU
NXR
VKN
NJY
NJY
NJY
PCI
PCI
New data sheet
Changed Boundary Scan order to match the B rev of these devices.
Removed 117-MHz Speed Bin
Address expansion pins/balls in the pinouts for all packages are modified
as per JEDEC standard
Added Address Expansion pins in the Pin Definitions Table
Changed Device Width (23:18) for 119-BGA from 000001 to 101001
Added separate row for 165 -FBGA Device Width (23:18)
Changed I
Changed I
Modified V
Corrected I
(V
Changed 
and 6.13 °C/W
respectively
Changed 
14.0 °C/W
respectively
Changed 
and 3.0 °C/W respectively
Added lead-free information for 100-pin TQFP, 119 BGA and 165 FBGA
packages
Updated Ordering Information Table
Changed I
Modified test condition in note# 14 from V
Changed address of Cypress Semiconductor Corporation on Page# 1
from “3901 North First Street” to “198 Champion Court”
Changed tri state to tri-state.
Modified “Input Load” to “Input Leakage Current except ZZ and MODE”
in the Electrical Characteristics Table.
Replaced Package Name column with Package Diagram in the Ordering
Information table.
Updated the ordering information.
Included Automotive range.
Added the Maximum Rating for Supply Voltage on V
Changed t
AC Switching Characteristics table.
Updated the Ordering Information table.
Included Soft Error Immunity Data
Modified Ordering Information table by including parts that are available
and modified the disclaimer for the Ordering information.
Added
Updated
Added
Minor edits and updated in new template.
Removed CY7C1363C-133AJXI part from
Minor edits and updated
IN
 V
Ordering Code
Acronyms
IH
Package
TH
DDZZ
SB1
or V
SB2
OL,
SB4
JA
JA
JA
, t
and 
V
and 
and 
and I
from 30 to 40 mA
TL
IN
Test Condition from (V
OH
from 35 mA to 50 mA
from 25 ns to 20 ns and t
V
and
Diagrams.
test conditions
SB3
Jc
Jc
Jc
IL
) in the Electrical Characteristics table
for BGA Package from 25 and 6°C/W to 34.1 and
Units of
for FBGA Package from 27 and 6 °C/W to 16.8
for TQFP Package from 25 and 9 °C/W to 29.41
Definitions.
Description of Change
from 40 mA to 110 and 100 mA, respectively
Pin
Definitions.
Measure.
CY7C1361C/CY7C1363C
IN
 V
TDOV
IH
Ordering
DD
< V
– 0.3V or V
from 5 ns to 10 ns in TAP
DD
to V
DDQ
Information.
IH
Relative to GND
V
IN
DD
Page 33 of 34
 0.3V) to
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