CY62157EV30LL-45BVXI Cypress Semiconductor Corp, CY62157EV30LL-45BVXI Datasheet

IC SRAM 8MBIT 45NS 48VFBGA

CY62157EV30LL-45BVXI

Manufacturer Part Number
CY62157EV30LL-45BVXI
Description
IC SRAM 8MBIT 45NS 48VFBGA
Manufacturer
Cypress Semiconductor Corp
Type
Asynchronousr
Datasheet

Specifications of CY62157EV30LL-45BVXI

Memory Size
8M (512K x 16)
Package / Case
48-VFBGA
Format - Memory
RAM
Memory Type
SRAM
Speed
45ns
Interface
Parallel
Voltage - Supply
2.2 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Access Time
45 ns
Supply Voltage (max)
3.6 V
Supply Voltage (min)
2.2 V
Maximum Operating Current
25 mA
Organization
512 K x 16
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Number Of Ports
1
Operating Supply Voltage
3 V
Memory Configuration
512K X 16
Supply Voltage Range
2.2V To 3.6V
Memory Case Style
BGA
No. Of Pins
48
Operating Temperature Range
-40°C To +85°C
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
428-2078
CY62157EV30LL-45BVXI

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY62157EV30LL-45BVXI
Manufacturer:
PANASONIC
Quantity:
1 000
Part Number:
CY62157EV30LL-45BVXI
Manufacturer:
CYPRESS
Quantity:
181
Part Number:
CY62157EV30LL-45BVXI
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Part Number:
CY62157EV30LL-45BVXI
Manufacturer:
CY
Quantity:
1 000
Part Number:
CY62157EV30LL-45BVXI
Manufacturer:
CYPRESS/赛普拉斯
Quantity:
20 000
Part Number:
CY62157EV30LL-45BVXI
0
Part Number:
CY62157EV30LL-45BVXIT
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Part Number:
CY62157EV30LL-45BVXIT
Manufacturer:
CYPRESS/赛普拉斯
Quantity:
20 000
Features
Cypress Semiconductor Corporation
Document #: 38-05445 Rev. *H
Logic Block Diagram
Thin small outline package (TSOP) I package configurable as
512K x 16 or 1M x 8 static RAM (SRAM)
High speed: 45 ns
Temperature ranges
Wide voltage range: 2.20V to 3.60V
Pin compatible with CY62157DV30
Ultra low standby power
Ultra low active power
Easy memory expansion with CE
Automatic power down when deselected
Complementary Metal Oxide Semiconductor (CMOS) for
optimum speed and power
Available in Pb-free and non Pb-free 48-Ball very fine ball grid
array (VFBGA), Pb-free 44-Pin TSOP II and 48-Pin TSOP I
packages
Industrial: –40°C to +85°C
Automotive-A: –40°C to +85°C
Automotive-E: –40°C to +125°C
Typical standby current: 2 A
Maximum standby current: 8 A (Industrial)
Typical active current: 1.8 mA at f = 1 MHz
Power Down
Circuit
A
A
A
A
A
A
A
A
A
A
A
10
9
8
7
6
5
4
3
2
1
0
1
, CE
CE
CE
2
, and OE features
BHE
BLE
2
1
198 Champion Court
COLUMN DECODER
512K × 16/1M x 8
DATA IN DRIVERS
RAM Array
Functional Description
The CY62157EV30 is a high performance CMOS static RAM
organized as 512K words by 16 bits. This device features
advanced circuit design to provide ultra low active current. This
is ideal for providing More Battery Life (MoBL
applications such as cellular telephones. The device also has an
automatic power down feature that significantly reduces power
consumption when addresses are not toggling. Place the device
into standby mode when deselected (CE
both BHE and BLE are HIGH). The input or output pins (I/O
through I/O
device is deselected (CE
disabled (OE HIGH), Byte High Enable and Byte Low Enable are
disabled (BHE, BLE HIGH), or a write operation is active (CE
LOW, CE
To write to the device, take Chip Enable (CE
HIGH) and Write Enable (WE) inputs LOW. If Byte Low Enable
(BLE) is LOW, then data from I/O pins (I/O
written into the location specified on the address pins (A
A
(I/O
address pins (A
To read from the device, take Chip Enable (CE
HIGH) and Output Enable (OE) LOW while forcing the Write
Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then data
from the memory location specified by the address pins appear
on I/O
memory appears on I/O
11
For best practice recommendations, refer to the Cypress
application note
8 Mbit (512K x 16) Static RAM
18
for a complete description of read and write modes.
). If Byte High Enable (BHE) is LOW, then data from I/O pins
8
through I/O
0
to I/O
2
HIGH and WE LOW).
15
San Jose
7
) are placed in a high impedance state when the
. If Byte High Enable (BHE) is LOW, then data from
0
AN1064, SRAM System
15
through A
) is written into the location specified on the
,
CA 95134-1709
8
1
to I/O
HIGH or CE
CY62157EV30 MoBL
18
).
15
I/O
I/O
OE
BLE
BYTE
BHE
WE
. See the
0
8
Revised December 20, 2010
–I/O
–I/O
2
7
15
LOW), the outputs are
1
Guidelines.
HIGH or CE
0
Truth Table on page
through I/O
1
LOW and CE
1
®
CE
CE
LOW and CE
) in portable
408-943-2600
1
2
2
0
LOW or
7
through
) is
2
0
®
1
2
[+] Feedback

Related parts for CY62157EV30LL-45BVXI

CY62157EV30LL-45BVXI Summary of contents

Page 1

... Power Down Circuit Cypress Semiconductor Corporation Document #: 38-05445 Rev Mbit (512K x 16) Static RAM Functional Description The CY62157EV30 is a high performance CMOS static RAM organized as 512K words by 16 bits. This device features advanced circuit design to provide ultra low active current. This is ideal for providing More Battery Life ...

Page 2

Contents Pin Configuration ............................................................. 3 Product Portfolio .............................................................. 3 Maximum Ratings ............................................................. 4 Operating Range ............................................................... 4 Electrical Characteristics ................................................. 4 Capacitance ...................................................................... 5 Thermal Resistance .......................................................... 5 Data Retention Characteristics ....................................... 6 Data Retention Waveform ................................................ 6 Switching Characteristics ...

Page 3

... Product Portfolio Product Range Min CY62157EV30LL Industrial/ 2.2 Auto-A Auto-E 2.2 Notes 1. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured pins are not connected on the die. 3. The 44-TSOP II package has only one chip enable (CE) pin. ...

Page 4

... BLE) and BYTE (48 TSOP I only) need to be tied to CMOS levels to meet the left floating. Document #: 38-05445 Rev. *H Output Current into Outputs (LOW) ............................ 20 mA Static Discharge Voltage .......................................... > 2001V (MIL-STD-883, Method 3015) Latch Up Current ................................................... > 200 mA Operating Range Device + 0.3V) CY62157EV30LL CCmax + 0.3V) CCmax + 0.3V) CC max 45 ns (Ind’l/Auto-A) Test Conditions Min Typ 2.0 > 2.70V 2 ...

Page 5

Capacitance Tested initially and after any design or process changes that may affect these parameters. Parameter Description C Input capacitance Output capacitance OUT Thermal Resistance Tested initially and after any design or process changes ...

Page 6

Data Retention Characteristics Over the Operating Range Parameter Description V V for data retention Data retention current CCDR CE [11] t Chip deselect to data CDR retention time [12] t Operation recovery time R Data Retention ...

Page 7

... If both byte enables are toggled together, this value is 10 ns. 19. The internal write time of the memory is defined by the overlap of WE write and any of these signals can terminate a write by going inactive. The data input setup and hold timing must be referenced to the edge of the signal that terminates the write ...

Page 8

Switching Waveforms Figure 6 shows Address Transition Controlled read cycle waveforms. ADDRESS DATA OUT PREVIOUS DATA VALID Figure 7 shows OE Controlled read cycle waveforms. ADDRESS BHE/BLE t LZBE OE HIGH IMPEDANCE DATA OUT t ...

Page 9

... HZOE Notes 23. The internal write time of the memory is defined by the overlap of WE write and any of these signals can terminate a write by going inactive. The data input setup and hold timing must be referenced to the edge of the signal that terminates the write. 24. Data I/O is high impedance ...

Page 10

Switching Waveforms (continued) Figure 10 shows WE Controlled, OE LOW write cycle waveforms. ADDRESS BHE/BLE NOTE 28 DATA I/O t HZWE Figure 11 shows BHE/BLE Controlled, OE LOW write cycle waveforms. ADDRESS CE ...

Page 11

Truth Table BHE 1 2 [29 [29 [29] [29 ...

Page 12

... Ordering Information Speed (ns) Ordering Code 45 CY62157EV30LL-45BVI CY62157EV30LL-45BVXI CY62157EV30LL-45ZSXI CY62157EV30LL-45ZXI CY62157EV30LL-45BVXA CY62157EV30LL-45ZSXA CY62157EV30LL-45ZXA 55 CY62157EV30LL-55ZSXE CY62157EV30LL-55ZXE Contact your local Cypress sales representative for availability of these parts. Ordering Code Definitions E V30 LL xx xxx CY 621 5 7 Document #: 38-05445 Rev. *H Package Package Type Diagram 51-85150 48-ball very fine pitch ball grid array ...

Page 13

Package Diagrams Figure 12. 48-Pin VFBGA ( mm), 51-85150 Document #: 38-05445 Rev. *H ® CY62157EV30 MoBL 51-85150-*E Page [+] Feedback ...

Page 14

Package Diagrams (continued TOP VIEW 0.400(0.016) 0.800 BSC 0.300 (0.012) (0.0315) 18.517 (0.729) 18.313 (0.721) DIMENSION IN MM (INCH) MAX MIN. Document #: 38-05445 Rev. *H Figure 13. 44-Pin TSOP II, 51-85087 PIN 1 I. BASE ...

Page 15

Package Diagrams (continued) Figure 14. 48-Pin TSOP 1.0 mm), 51-85183 Document #: 38-05445 Rev. *H ® CY62157EV30 MoBL 51-85183-*B Page [+] Feedback ...

Page 16

Document History Page Document Title: CY62157EV30 MoBL Document Number: 38-05445 Orig. of Submission Rev. ECN No. Change Date ** 202940 AJU See ECN *A 291272 SYT See ECN *B 444306 NXR See ECN *C 467052 NXR See ECN *D 925501 ...

Page 17

... Cypress against all charges. Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign), United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress integrated circuit as specified in the applicable agreement ...

Related keywords