W25Q80BVDAIG Winbond Electronics, W25Q80BVDAIG Datasheet - Page 6

• Manufacturer Part Number: W25Q80BVDAIG
• Description: SPI FLASH 8MBIT 8-DIP
• Manufacturer: Winbond Electronics

Specifications of W25Q80BVDAIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 8M (1M x 8)
• Speed: 104MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

4. PAD CONFIGURATION WSON 6X5-MM
3. PIN CONFIGURATION SOIC 150 / 208-MIL
Figure 1a. W25Q80BV Pin Assignments, 8-pin SOIC 150 / 208-mil (Package Code SN & SS)
/WP (IO
Figure 1b. W25Q80BV Pad Assignments, 8-pad WSON 6x5-mm (Package Code ZP)
DO (IO
GND
/WP (IO
/CS
DO (IO
1
2
)
)
GND
/CS
1
2
)
)
1
2
3
4
Top View
Top View
1
2
3
4
- 6 -
8
7
6
5
8
7
6
5
VCC
/HOLD (IO
CLK
DI (IO
VCC
/HOLD (IO
CLK
DI (IO
0
)
3
0
)
)
W25Q80BV
3
)