CY62256VNLL-70ZXI Cypress Semiconductor Corp, CY62256VNLL-70ZXI Datasheet - Page 4

IC SRAM 256KBIT 70NS 28TSOP

CY62256VNLL-70ZXI

Manufacturer Part Number
CY62256VNLL-70ZXI
Description
IC SRAM 256KBIT 70NS 28TSOP
Manufacturer
Cypress Semiconductor Corp
Type
Asynchronousr

Specifications of CY62256VNLL-70ZXI

Memory Size
256K (32K x 8)
Package / Case
28-TSOP I
Format - Memory
RAM
Memory Type
SRAM
Speed
70ns
Interface
Parallel
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Access Time
70 ns
Supply Voltage (max)
3.6 V
Supply Voltage (min)
2.7 V
Maximum Operating Current
30 mA
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Number Of Ports
1
Operating Supply Voltage
3 V
Density
256Kb
Access Time (max)
70ns
Sync/async
Asynchronous
Architecture
Not Required
Clock Freq (max)
Not RequiredMHz
Operating Supply Voltage (typ)
3V
Address Bus
15b
Package Type
TSOP-I
Operating Temp Range
-40C to 85C
Supply Current
30mA
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
28
Word Size
8b
Number Of Words
32K
Memory Configuration
32K X 8
Supply Voltage Range
2.7V To 3.6V
Memory Case Style
TSOP
No. Of Pins
28
Operating Temperature Range
-40°C To +85°C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
428-2085
CY62256VNLL-70ZXI

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY62256VNLL-70ZXI
Manufacturer:
CYPRESS
Quantity:
3 696
Part Number:
CY62256VNLL-70ZXI
Manufacturer:
CY
Quantity:
19
Capacitance
Thermal Resistance
Data Retention Characteristics
Notes
Document #: 001-06512 Rev. *B
C
C
V
I
t
t
5. Tested initially and after any design or process changes that may affect these parameters.
6. No input may exceed V
CCDR
CDR
R
Parameter
Parameter
DR
IN
OUT
Parameter
[5]
Θ
Θ
[6]
V
CE
CC
JC
JA
Thermal Resistance
(Junction to Ambient)
Thermal Resistance
(Junction to Case)
Input Capacitance
Output Capacitance
V
Data Retention Current
Chip Deselect to Data
Retention Time
Operation Recovery Time
OUTPUT
Parameter
CC
[5]
V
INCLUDING
RTH
VTH
for Data Retention
R1
R2
CC
CC
JIG AND
Description
Description
Description
SCOPE
+ 0.3V.
50 pF
[5]
R1
t
CDR
1.8V
Equivalent to:
R2
Figure 1. AC Test Loads and Waveforms
(Over the Operating Range)
Figure 2. Data Retention Waveform
V
CE > V
V
or V
T
V
Still Air, soldered on a 3 × 4.5 inch,
two-layer printed circuit board
CC
IN
A
CC
> V
IN
= 25°C, f = 1 MHz,
= 1.4V,
= 3.0V
< 0.3V
CC
OUTPUT
CC
– 0.3V,
– 0.3V
DATA RETENTION MODE
Test Conditions
Test Conditions
Conditions
THÉ VENIN EQUIVALENT
V
GND
Value
V
1.750
1100
1500
DR
645
CC
< 5 ns
> 1.4V
R
th
[6]
10%
Com’l
Ind’l/Auto-A
Auto-E
ALL INPUT PULSES
90%
V
th
68.45
26.94
SOIC
1.8V
Min
1.4
t
RC
0
t
R
Max
6
8
90%
TSOPI
10%
87.62
23.73
Typ
0.1
< 5 ns
[2]
Ohms
Ohms
Ohms
Units
Volts
CY62256VN
RTSOPI
87.62
23.73
Max
50
3
6
Page 4 of 13
Unit
pF
pF
°C/W
°C/W
Unit
Unit
μA
ns
ns
V
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