W25Q80BVSSIG Winbond Electronics, W25Q80BVSSIG Datasheet - Page 72
W25Q80BVSSIG
Manufacturer Part Number
W25Q80BVSSIG
Description
IC FLASH 8MBIT 8SOIC
Manufacturer
Winbond Electronics
Datasheet
1.W25Q80BVSSIG.pdf
(75 pages)
Specifications of W25Q80BVSSIG
Format - Memory
FLASH
Memory Type
FLASH
Memory Size
8M (1M x 8)
Speed
104MHz
Interface
SPI Serial
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
Q4816329
T1015683
T1015683
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
W25Q80BVSSIG
Manufacturer:
Winbond
Quantity:
2 100
Company:
Part Number:
W25Q80BVSSIG
Manufacturer:
WINBOND
Quantity:
192
Part Number:
W25Q80BVSSIG
Manufacturer:
WINBOND/华邦
Quantity:
20 000
8-Pad WSON 6x5mm Cont’d.
Notes:
1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. The metal pad area on the bottom center of the package is connected to the device ground (GND pin). Avoid placement of
exposed PCB vias under the pad.
SYMBOL
M
Q
N
P
R
Min
MILLIMETERS
SOLDER PATTERN
Nom
3.40
4.30
6.00
0.50
0.75
- 72 -
Max
Min
INCHES
Nom
0.134
0.169
0.236
0.020
0.026
Max
W25Q80BV