W25Q80BVSSIG Winbond Electronics, W25Q80BVSSIG Datasheet - Page 68
W25Q80BVSSIG
Manufacturer Part Number
W25Q80BVSSIG
Description
IC FLASH 8MBIT 8SOIC
Manufacturer
Winbond Electronics
Datasheet
1.W25Q80BVSSIG.pdf
(75 pages)
Specifications of W25Q80BVSSIG
Format - Memory
FLASH
Memory Type
FLASH
Memory Size
8M (1M x 8)
Speed
104MHz
Interface
SPI Serial
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
Q4816329
T1015683
T1015683
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
W25Q80BVSSIG
Manufacturer:
Winbond
Quantity:
2 100
Company:
Part Number:
W25Q80BVSSIG
Manufacturer:
WINBOND
Quantity:
192
Part Number:
W25Q80BVSSIG
Manufacturer:
WINBOND/华邦
Quantity:
20 000
11. PACKAGE SPECIFICATION
11.1 8-Pin SOIC 150-mil (Package Code SN)
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.
SEATING PLANE
SEATING PLANE
Y
Y
SYMBOL
8
8
1
1
D
E
Y
A1
e
H
A
θ
b
L
c
(2)
(4)
(3)
(3)
E
b
b b b
D
D
Min
1.35
0.10
0.33
0.19
3.80
4.80
5.80
0.40
---
0°
MILLIMETERS
e
e
1.27 BSC
5
5
4
4
A1
A1
Max
E H
E H
E H
1.75
0.25
0.51
0.25
4.00
5.00
6.20
0.10
1.27
A
A
10°
- 68 -
E
E
E
0.053
0.004
0.013
0.008
0.150
0.188
0.228
0.016
Min
---
0°
INCHES
0.050 BSC
0.069
0.010
0.020
0.010
0.157
0.196
0.244
0.004
0.050
Max
0.25
0.25
10°
W25Q80BV
GAUGE PLANE
GAUGE PLANE
c
c
L
L
θ
θ