M24C02-WBN6P STMicroelectronics, M24C02-WBN6P Datasheet - Page 29
M24C02-WBN6P
Manufacturer Part Number
M24C02-WBN6P
Description
IC EEPROM 2KBIT 400KHZ 8DIP
Manufacturer
STMicroelectronics
Datasheets
1.M24C01-WMN6TP.pdf
(39 pages)
2.M24C02-WBN6P.pdf
(10 pages)
3.M24C02-WBN6P.pdf
(28 pages)
Specifications of M24C02-WBN6P
Format - Memory
EEPROMs - Serial
Memory Type
EEPROM
Memory Size
2K (256 x 8)
Speed
400kHz
Interface
I²C, 2-Wire Serial
Voltage - Supply
2.5 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-DIP (0.300", 7.62mm)
Organization
256 K x 8
Interface Type
I2C
Maximum Clock Frequency
0.4 MHz
Access Time
900 ns
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2.5 V
Maximum Operating Current
2 mA
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
Minimum Operating Temperature
- 40 C
Operating Supply Voltage
6.5 V
Capacitance, Input
8 pF (SDA), 6 pF (Other Pins)
Current, Input, Leakage
±2 μA
Current, Operating
2 mA
Current, Output, Leakage
±2
Data Retention
>40 yrs.
Density
2K
Package Type
PDIP8
Temperature, Operating
-40 to +85 °C
Time, Access
900 ns
Time, Fall
50 ns
Time, Rise
50 ns
Voltage, Esd
4000 V
Voltage, Input, High
3.5 to 6.5 V
Voltage, Input, Low
0.75 to 1.65 V
Voltage, Output, Low
0.4 V
Voltage, Supply
2.5 to 5.5 V
Memory Configuration
256 X 8
Clock Frequency
400kHz
Supply Voltage Range
2.5V To 5.5V
Memory Case Style
DIP
No. Of Pins
8
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
497-8584-5
M24C02-WBN6P
M24C02-WBN6P
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
M24C02-WBN6P
Manufacturer:
ST
Quantity:
20 000
M24C16, M24C08, M24C04, M24C02, M24C01
Figure 15. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
1. Drawing is not to scale.
2. The central pad (the area E2 by D2 in the above illustration) is pulled, internally, to V
3. The circle in the top view of the package indicates the position of pin 1.
Table 21.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from
D2 (rev MB)
D2 (rev MC)
E2 (rev MC)
E2 (rev MB)
Symbol
allowed to be connected to any other voltage or signal line on the PCB, for example during the soldering
process.
measuring.
ddd
A1
L1
L3
A
A
D
E
K
b
e
L
(2)
E
A1
2 x 3 mm, outline
UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, data
0.55
0.02
0.25
0.05
Typ
1.6
0.2
0.5
D
2
3
-
-
-
millimeters
Doc ID 5067 Rev 16
ddd
0.45
1.45
1.25
Min
0.1
0.2
1.9
1.5
2.9
0.3
0.3
0.3
L3
0
-
-
-
REV MB
D2
Max
0.05
0.15
e
0.6
0.3
2.1
1.7
1.7
3.1
0.3
1.6
0.5
-
-
-
-
b
L1
E2
K
L
0.0098
0.0787
0.0079
0.0217
0.0008
0.1181
0.0197
0.063
0.002
Typ
-
-
-
-
L3
Pin 1
L
Package mechanical data
inches
0.0177
0.0079
0.0748
0.0591
0.0571
0.1142
0.0039
0.0492
0.0118
0.0118
0.0118
REV MC
Min
SS
D2
0
-
-
e
. It must not be
(1)
b
ZW_MEc
0.0236
0.0118
0.0827
0.0669
0.0669
0.0118
0.0197
0.0059
L1
E2
K
0.002
0.122
0.063
Max
-
-
-
-
29/39