MT46H16M32LFCM-6:B TR Micron Technology Inc, MT46H16M32LFCM-6:B TR Datasheet - Page 3
![IC DDR SDRAM 512MBIT 90VFBGA](/photos/7/23/72313/mfg557-90-vfbga_sml.jpg)
MT46H16M32LFCM-6:B TR
Manufacturer Part Number
MT46H16M32LFCM-6:B TR
Description
IC DDR SDRAM 512MBIT 90VFBGA
Manufacturer
Micron Technology Inc
Type
DDR SDRAMr
Specifications of MT46H16M32LFCM-6:B TR
Format - Memory
RAM
Memory Type
Mobile DDR SDRAM
Memory Size
512M (16M x 32)
Speed
166MHz
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.95 V
Operating Temperature
0°C ~ 70°C
Package / Case
90-VFBGA
Organization
16Mx32
Density
512Mb
Address Bus
15b
Access Time (max)
6.5/5ns
Maximum Clock Rate
166MHz
Operating Supply Voltage (typ)
1.8V
Package Type
VFBGA
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
1.95V
Operating Supply Voltage (min)
1.7V
Supply Current
115mA
Pin Count
90
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
557-1381-2
Package Differences
Figure 2:
PDF: 09005aef82dfb176 / Source: 09005aef82dfb194
tn4616_512_mddr_95_to_78nm_t37_47m.fm - Rev. B 9/07 EN
Seating
Dimensions apply
to solder balls
post-reflow. The
pre-reflow balls
are Ø0.42 on Ø0.4
SMD ball pads.
plane
0.1 A
7.2
60X Ø0.45
0.8 TYP
3.6
0.8 TYP
Previous 95nm, x16, 10mm x 11mm, 60-ball VFBGA
A
Notes:
9
The 95nm, x16 and x32 products use SAC305 package solder ball composition, as shown
in Figure 2.
Both the x16 (60-ball) and the x32 (90-ball) packages for the 78nm product use SAC105
solder ball composition. This aligns with the industry trend toward SAC105 composition
for enhanced drop test performance. The surface mount conditions for SAC105 are the
same as for SAC305.
In addition, the 78nm, x16 product offers a smaller, 8mm x 9mm package outline to
conserve application board space, as shown in Figure 3 on page 4. The ball assignments
for both 78nm packages are JEDEC compliant.
1. Dimensions are in millimeters.
8
7
10 ±0.1
6.4
3.2
3
5 ±0.05
2
1
A
B
C
D
G
H
K
TN-46-16: 512Mb Mobile DDR: 95nm to 78nm
E
F
J
3
5.75 ±0.05
Ball A1 ID
0.65 ±0.05
11.5 ±0.1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.0 MAX
Solder ball material:
SAC305 (96.5% Sn, 3% Ag, 0.5% Cu)
Substrate material: plastic laminate
Mold compound: epoxy novolac
Package Differences
Ball A1 ID
©2007 Micron Technology, Inc. All rights reserved.