MT46H16M32LFCM-6:B TR Micron Technology Inc, MT46H16M32LFCM-6:B TR Datasheet
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MT46H16M32LFCM-6:B TR
Specifications of MT46H16M32LFCM-6:B TR
Related parts for MT46H16M32LFCM-6:B TR
MT46H16M32LFCM-6:B TR Summary of contents
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... TN-46-16: 512Mb Mobile DDR: 95nm to 78nm 78nm Part Number MT46H16M32LFCM-6:B MT46H16M32LFCM-6 IT:B MT46H16M32LFCM-6:B MT46H16M32LFCM-6 IT:B MT46H32M16LFBF-6:B MT46H32M16LFBF-6 IT:B MT46H32M16LFBF-6:B MT46H32M16LFBF-6 IT:B Micron Technology, Inc., reserves the right to change products or specifications without notice. ...
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Figure 1: Status Read Register DQ31...DQ16 DQ15 DQ14 DQ13 31... Reserved Density S15 S14 S13 Density 128Mb 256Mb 512Mb 1,024Mb 0 0 Reserved 1 1 ...
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Package Differences The 95nm, x16 and x32 products use SAC305 package solder ball composition, as shown in Figure 2. Both the x16 (60-ball) and the x32 (90-ball) packages for the 78nm product use SAC105 solder ball composition. This aligns with ...
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Figure 3: New 78nm, x16 9mm, 60-ball VFBGA Seating plane A 0.1 A 60x Ø0.45 Dimensions apply to solder balls post-reflow. The pre-reflow balls are Ø0.42 on Ø0.4 SMD ball pads. 3.6 7.2 0.8 TYP ...
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Table 2: Bond Pad Order Comparison 95nm, Double-Sided x16 BOND_OPT CKE CAS# RAS BA1 BA0 WE# ...
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Summary Micron periodically offers product performance improvements through process node migration. This is the case with the product transition from 95nm to 78nm. Designers should consult product data sheets for detailed information on product differences before proceeding with product transitions. ...