SA606D,118 NXP Semiconductors, SA606D,118 Datasheet - Page 29

• Manufacturer Part Number: SA606D,118
• Description: Up-Down Converters LV HI PERF MIXER FM IF SYSTEM
• Manufacturer: NXP Semiconductors

Specifications of SA606D,118

• Power Gain: 19.5 dB
• Operating Supply Voltage: 3.3 V, 5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: SO-20
• Minimum Operating Temperature: - 40 C
• Factory Pack Quantity: 2000

NXP Semiconductors
21. Contents
1
2
3
4
5
6
6.1
6.2
7
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10
11
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14
15
16
16.1
16.2
16.3
16.4
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18
19
19.1
19.2
19.3
19.4
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21
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
Thermal characteristics . . . . . . . . . . . . . . . . . . 6
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
Dynamic characteristics . . . . . . . . . . . . . . . . . . 7
Performance curves . . . . . . . . . . . . . . . . . . . . . 8
Application information. . . . . . . . . . . . . . . . . . 14
Test information . . . . . . . . . . . . . . . . . . . . . . . . 18
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 21
Soldering of SMD packages . . . . . . . . . . . . . . 23
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 26
Legal information. . . . . . . . . . . . . . . . . . . . . . . 27
Contact information. . . . . . . . . . . . . . . . . . . . . 28
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Introduction to soldering . . . . . . . . . . . . . . . . . 23
Wave and reflow soldering . . . . . . . . . . . . . . . 23
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 23
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 24
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 27
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Low-voltage high performance mixer FM IF system
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Date of release: 24 July 2012
Document identifier: SA606
All rights reserved.
SA606