MAX16046ETN+CK4 Maxim Integrated, MAX16046ETN+CK4 Datasheet - Page 3

• Manufacturer Part Number: MAX16046ETN+CK4
• Description: Supervisory Circuits 12Ch EEPROM Prob System Manager
• Manufacturer: Maxim Integrated
• Series: MAX16046, MAX16048r

Specifications of MAX16046ETN+CK4

• Rohs: yes

ABSOLUTE MAXIMUM RATINGS
V
EN, MON_, SCL, SDA, A0 to GND ...........................-0.3V to +6V
GPIO_, RESET (configured as open drain) to GND.....-0.3V to +6V
EN_OUT1–EN_OUT6 (configured as open drain)
EN_OUT7–EN_OUT12 (configured as open drain)
GPIO_, EN_OUT_, RESET
DBP, ABP to GND .........-0.3V to the lower of 3V or (V
PACKAGE THERMAL CHARACTERISTICS (Note 1)
56 TQFN
ELECTRICAL CHARACTERISTICS
(V
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
Operating Voltage Range
Undervoltage Lockout
Undervoltage-Lockout Hysteresis
Supply Current
DBP Regulator Voltage
ABP Regulator Voltage
Boot Time
Internal Timing Accuracy
ADC
ADC Resolution
ADC Total Unadjusted Error
(Note 5)
ADC Integral Nonlinearity
ADC Differential Nonlinearity
ADC Total Monitoring Cycle Time
MON_ Input Impedance
ADC MON_ Ranges
CC
System Managers with Nonvolatile Fault Registers
Junction-to-Ambient Thermal Resistance (θ
Junction-to-Case Thermal Resistance (θ
to GND.................................................................-0.3V to +12V
to GND...................................................................-0.3V to +6V
(configured as push-pull) to GND .........-0.3V to (V
CC
to GND ....................……………………………-0.3V to +15V
= 3V to 14V, T
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
12-Channel/8-Channel EEPROM-Programmable
A
= -40°C to +85°C, unless otherwise specified. Typical values are at V
UVLO
SYMBOL
ADC
ADC
ADC
ADC
t
V
JC
t
CYCLE
V
V
BOOT
V
UVLO
I
R
DBP
ABP
CC
)........................1°C/W
CC
IN
JA
RNG
ERR
DNL
INL
HYS
).................21°C/W
RESET output asserted low
(Note 3)
V
output
C
C
V
(Note 4)
MON_ range set to ‘00’ in r0Fh–r11h
MON_ range set to ‘01’ in r0Fh–r11h
MON_ range set to ‘10’ in r0Fh–r11h
MAX16046, all channels monitored,
no MON_ fault detected (Note 6)
MON1–MON4
MON5–MON12
MON_ range set to ‘00’ in r0Fh–r11h
MON_ range set to ‘01’ in r0Fh–r11h
MON_ range set to ‘10’ in r0Fh–r11h
DBP
CC
CC
CC
DBP
ABP
+ 0.3V)
+ 0.3V)
= 14V, V
> V
= 1µF, no load on any output
= 1µF, no load on any DACOUT_
UVLO
EN
CONDITIONS
= 3.3V, no load on any
TCK, TMS, TDI to GND..........................................-0.3V to +3.6V
TDO to GND .............................................-0.3V to (V
DACOUT_ to GND....………………………-0.3V to (V
EN_OUT1–EN_OUT6
Continuous Current (all pins)............................................±20mA
TQFN (derate 47.6mW/°C above +70°C) ......................3810mW
TQFP (derate 43.5mW/°C above +70°C) ....................3478.3mW
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
64 TQFP
(configured as charge pump) to GND ....-0.3V to (V
Junction-to-Ambient Thermal Resistance (θ
Junction-to-Case Thermal Resistance (θ
CC
= 3.3V, T
2.78
MIN
1.4
2.6
46
65
-5
3
A
= +25°C.) (Note 2)
TYP
2.88
4.8
2.7
0.8
5.6
2.8
1.4
50
10
80
JC
)...........................1°C/W
JA
)...................23°C/W
MAX
2.85
2.96
0.65
0.75
0.95
100
100
140
6.5
2.8
1.5
0.8
0.8
+5
14
MON1–6
DBP
ABP
UNITS
%FSR
+ 0.3V)
+ 0.3V)
LSB
LSB
Bits
mV
mA
ms
kΩ
µs
%
+ 6V)
V
V
V
V
V
3