MCIMX251AJM4AR2 Freescale Semiconductor, MCIMX251AJM4AR2 Datasheet - Page 111
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MCIMX251AJM4AR2
Manufacturer Part Number
MCIMX251AJM4AR2
Description
Processors - Application Specialized IMX25 1.2 AUTO
Manufacturer
Freescale Semiconductor
Datasheet
1.MCIMX251AJM4AR2.pdf
(140 pages)
Specifications of MCIMX251AJM4AR2
Core
ARM926EJ-S
Processor Series
MCIMX25
Maximum Clock Frequency
400 MHz
Instruction / Data Cache Memory
16 KB
Data Ram Size
128 KB
Operating Supply Voltage
1.15 V to 1.52 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
MAPBGA-400
Interface Type
USB
Memory Type
DDR2
Minimum Operating Temperature
- 40 C
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1
2
3
4
3.7.18.2
Figure 82
of the internal ADC. After a conversion cycle eoc is asserted, a new conversion begins only when the
Freescale Semiconductor
Power-down current
NVCC_ADC
QV
Expected plate resistance
Switch drivers on resistance
DNL
INL
Gain + Offset Error
This comprises only the required initial dummy conversion cycle. Additional power-up time depends on the enadc , reset and
soc signals applied to the touchscreen controller.
This value only includes the ADC and the driver switches, but it does not take into account the current consumption in the
touchscreen plate. For example, if the plate resistance is 100 W, the total current consumption is about 33 mA.
At avdd = 3.3 V, dvdd = 1.2 V, Tjunction = 50 °C, fclk = 1.75 MHz, any process corner, unless otherwise noted.
Value measured with a –0.5 dBFS sinusoidal input signal and computed with the code density test.
DD
4
4
represents the synchronization between the signals clk, soc, eoc, and the output bits in the usage
Parameter
ADC Timing Diagrams
Table 85. Touchscreen ADC Electrical Specifications (continued)
i.MX25 Applications Processor for Automotive Products, Rev. 9
GND and VDD switches
fin = 1 kHz
fin = 1 kHz
Conversion Characteristics
Touchscreen Interface
Conditions
—
—
—
3
Min.
100
—
—
—
—
—
+/–0.75
+/–2.0
Typ.
—
—
—
—
Max.
1500
+/–2
10
10
—
—
1
%FS
Unit
LSB
LSB
uA
uA
111
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