MCIMX508CZK8B Freescale Semiconductor, MCIMX508CZK8B Datasheet - Page 22

• Manufacturer Part Number: MCIMX508CZK8B
• Description: Processors - Application Specialized CODEX REV 1.1
• Manufacturer: Freescale Semiconductor
• Type: Multimedia Applicationsr

Specifications of MCIMX508CZK8B

• Core: ARM Cortex A8
• Processor Series: i.MX50

Electrical Characteristics
4.1.2
4.1.2.1
Table 8
1
2
3
4
5
6
22
1
Junction to Ambient (natural convection)
Junction to Ambient (natural convection)
Junction to Ambient (at 200 ft/min)
Junction to Ambient (at 200 ft/min)
Junction to Board
Junction to Case
Junction to Package Top (natural convection)
ESD damage immunity:
Storage temperature range
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
Per JEDEC JESD51-2 with the single layer board horizontal. The thermal test board meets JESD51-9 specification.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by using the cold plate method (MIL SPEC-883
Method 1012.1).
Thermal characterization parameter indicating the temperature difference between the package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as
Psi-JT.
The term OVDD in this section refers to the associated supply rail of an input or output. The maximum range can be
superseded by the DC tables.
provides thermal resistance data for a 13 x 13 mm MAPBGA package.
Thermal Resistance Data
Parameter Description
13 x 13 mm MAPBGA Package
5
4
Charge Device Model (CDM)
Rating
Human Body Model (HBM)
Table 8. 13 x 13 mm MAPBGA Package Thermal Resistance Data
i.MX50 Applications Processors for Consumer Products, Rev. 4
Table 7. Absolute Maximum Ratings (continued)
1, 3
1, 3
1, 2
1, 2, 3
6
Four layer board (2s2p)
Four layer board (2s2p)
Single layer board (1s)
Single layer board (1s)
Thermal Resistance Data
T
Board
Symbol
STORAGE
—
—
—
V
esd
Symbol
R
R
R
R
R
R
Ψ
θJMA
θJMA
Min
–40
θJA
θJA
θJB
θJC
—
—
JT
Freescale Semiconductor
Value
2000
Max
500
125
51
28
40
24
14
9
2
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Unit
o
V
C