VNH5050A-E STMicroelectronics, VNH5050A-E Datasheet
VNH5050A-E
Specifications of VNH5050A-E
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VNH5050A-E Summary of contents
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... Output protected against short to ground and short ® ■ Package: ECOPACK Description The VNH5050A full bridge motor driver intended for a wide range of automotive applications. The device incorporates a dual monolithic high-side driver and two low-side switches. All switches are designed using ® STMicroelectronics well known and proven Table 1 ...
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... Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 5.1 ECOPACK 5.2 PowerSSO-36 TP package information . . . . . . . . . . . . . . . . . . . . . . . . . . 29 5.3 PowerSSO-36 TP packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 2/33 Thermal calculation in clockwise and anti-clockwise operation in steady-state mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Thermal resistances definition (values according to the PCB heatsink area Thermal calculation in transient mode . . . . . . . . . . . . . . . . . . . . . . . . . . 26 ® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Doc ID 16009 Rev 10 VNH5050A-E ...
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... VNH5050A-E List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2. Block description Table 3. Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 6 Table 4. Pin definitions and functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Table 5. Pin functions description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table 6. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table 7. Thermal data Table 8. Power section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Table 9. Logic inputs (IN A Table 10. ...
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... PowerSSO-36 LSD thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . 27 Figure 21. Thermal fitting model of an H-bridge in PowerSSO-36 Figure 22. PowerSSO-36 TP package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Figure 23. PowerSSO-36 TP tube shipment (no suffix Figure 24. PowerSSO-36 TP tape and reel shipment (suffix “TR” 4/33 vs PCB copper area in open box free air condition . . . . . . . . . . 25 thj-amb Doc ID 16009 Rev 10 VNH5050A-E ...
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... VNH5050A-E 1 Block diagram and pin description Figure 1. Block diagram SOURCE_HS A DRAIN_LS A Table 2. Block description Name Logic control Undervoltage/overvoltage High-side and low-side clamp voltage High-side and low-side driver Current limitation High-side and low-side overtemperature protection Low-side overload detector Fault detection Power limitation ...
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... NC Not connected. IN Clockwise input. A Status of high-side and low-side switches A; EN /DIAG A A Open drain output. IN_PWM PWM input. CS Output of current sense. Doc ID 16009 Rev 10 VNH5050A-E INPUTx, PWM DRAIN_LSx DIAGx/ENx CS_DIS X Through 10 kΩ X resistor 36 GND_B DRAIN LS B GND_B GND_B Slug3 GND_B ...
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... VNH5050A-E Table 4. Pin definitions and functions (continued) Pin N° 23, 25, 26, 27, 28, 29, 35 30, 31, 32, 33, 34, 10, 11, 12 Table 5. Pin functions description Name V Battery connection. CC GND Power ground. OUT A Power connections to the motor. OUT B Voltage controlled input pins with hysteresis, CMOS compatible. These two pins ...
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... B CS DIAG / CS_DIS DIAG / PWM GND GND V V ENB pw Parameter (1) and IN pins /EN and DIAG A A Doc ID 16009 Rev 10 VNH5050A OUTA I OUTB V I OUTA SENSE I CSD V OUTB V SENSE V CSD Value + 41 Internally limited 25 +/- 10 /EN pins) +/- +/- 10 +/- 10 V -41/+V ...
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... VNH5050A-E 2.2 Thermal data Table 7. Thermal data Symbol R Thermal resistance junction-case (per leg) thj-case R Thermal resistance junction-ambient thj-amb Parameter HSD LSD Doc ID 16009 Rev 10 Electrical specifications Max. value Unit 3.7 °C/W 3.9 °C/W Figure 17 See °C/W 9/33 ...
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... A; T OUT ° OUTX 125° OUTX 8.5 A (see OUT Doc ID 16009 Rev 10 VNH5050A-E Min. Typ. Max. 5 -40 ° ° 150 ° 150 ° ° 150 °C = 150 °C ...
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... VNH5050A-E Table 9. Logic inputs (IN Symbol V Input low level voltage IL V Input high level voltage IH V Input hysteresis voltage IHYST V Input clamp voltage ICL I Input current INL I Input current INH Enable output low level V DIAG voltage Table 10. Switching (V Symbol f PWM frequency t Turn-on delay time ...
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... OUT CSD ° OUT CSD ° OUT CSD °C j Doc ID 16009 Rev 10 VNH5050A-E Min. Typ 150 175 135 16 150 175 Min. Typ. = 0.8 V; SENSE 4350 5100 150 ° ...
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... VNH5050A-E Table 12. Current sense (9 V < V Symbol Max analog sense V SENSE output voltage I Typical analog sense SENSETYP_500 Analog sense leakage I SENSE0 current Delay response time t from falling edge of DSENSEH CS_DIS pin Delay response time t from rising edge of DSENSEL CS_DIS pin 1. Analog sense current drift is deviation of factor K for a given device over (-40°C to 150°C and 9 V < ...
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... Electrical specifications Figure 4. Definition of the delay times measurement V INA V INB PWM I LOAD 14/33 t DEL Doc ID 16009 Rev 10 VNH5050A DEL ...
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... VNH5050A-E Figure 5. Definition of the low-side switching times PWM V OUTA, B Figure 6. Definition of the high-side switching times V INA V OUTA 90 10% 20 D(on) D(off) 90% Doc ID 16009 Rev 10 Electrical specifications t 80 10% t 15/33 ...
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... Electrical specifications Figure 7. Definition of dynamic cross conduction current during a PWM operation PWM I MOTOR V OUTB I CC Figure 8. Definition of delay response time of sense current INPUT CS_DIS LOAD CURRENT SENSE CURRENT 16/ DSENSEH Doc ID 16009 Rev 10 VNH5050A DSENSEL ...
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... VNH5050A-E Table 13. Truth table in normal operating conditions IN IN DIAG Table 14. Truth table in fault conditions (detected on OUT Note: In normal operating conditions the DIAG device. This pin must be externally pulled high. /EN DIAG ...
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... Doc ID 16009 Rev 10 Burst cycle/pulse repetition time Min. Max. 0.5s 5s 0.2s 5s 90ms 100ms 90ms 100ms = 13.5V except for pulse 5b Contents VNH5050A-E Delays and Impedance 2 ms, 10Ω 50µs, 2Ω 0.1µs, 50Ω 0.1µs, 50Ω 100ms, 0.01Ω 400ms, 2Ω ...
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... VNH5050A-E 2.4 Waveforms Figure 9. Waveforms in full-bridge operation DIAG / DIAG / PWM OUT A OUT B I -> OUTA OUTB CS (*) CS_DIS (*) CS BEHAVIOUR DURING PWM MODE DEPENDS ON PWM FREQUENCY AND DUTY CYCLE NORMAL OPERATION (DIAG DIAG / DIAG / PWM OUT A OUT ...
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... OUT 20/33 OUT shorted to V (resistive short) and undervoltage shutdown A CC V<nominal softly shorted to V normal operation A CC OUT shorted to V (pure short) and undervoltage shutdown A CC V<nominal hardly shorted to V normal operation A CC Doc ID 16009 Rev 10 VNH5050A-E undervoltage shutdown undervoltage shutdown ...
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... VNH5050A-E 3 Application information In normal operating conditions the DIAG device. This pin must be externally pulled high. PWM pin usage: In all cases, a “0” on the PWM pin turns off both LS When PWM rises back to “1”, LS Figure 11. Typical application circuit for kHz PWM operation short circuit ...
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... A P-channel MOSFET connected to the V The device sustains no more than - reverse battery conditions because of the two body diodes of the Power MOSFETs. Additionally, in reverse battery condition the I/Os of VNH5050A-E is pulled down to the V 22/33 ) again, the input signal must rise from low to high level. X ...
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... DIAG /EN A DIAG /EN B PWM OUT A Note: The VNH5050A-E can easily be designed in multi-motors driving applications such as seat positioning systems where only one motor has to be driven at a time. DIAG to put unused half-bridges in high impedance. V – IOs R = --------------------------------- I Rmax ...
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... Thermal vias spaced 1.2 mm grid, Vias pad clearance thickness 0.2 mm, Thermal via diameter 0.3 mm +/- 0.08 mm, Cu thickness on vias 0.025 mm, Footprint dimension 4 6.5 mm. 24/33 Double layers: footprint 2 Double layers: 2cm Double layers: 8cm bottom layer middle layer: total coverage Doc ID 16009 Rev 10 VNH5050A-E ...
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... VNH5050A-E Figure 16. Chipset configuration Figure 17. Auto and mutual R condition 4.1.1 Thermal calculation in clockwise and anti-clockwise operation in steady-state mode Table 18. Thermal calculation in clockwise and anti-clockwise operation in steady- state mode OFF OFF ON OFF ON ON OFF 4.1.2 Thermal resistances definition (values according to the PCB heatsink ...
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... Mutual Thermal Impedance Junction to Ambient thHSABLSB = Mutual Thermal Impedance Junction to Ambient between Low Side CHIP hsls CHIP lsls Z THtp 1 δ – values set by user. d Doc ID 16009 Rev 10 ( dLSB amb dLSB amb thLS dLSB amb Z hsls CHIP VNH5050A-E ...
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... VNH5050A-E Figure 19. PowerSSO-36 HSD thermal impedance junction ambient single pulse 100 10 1 0.1 0.001 Figure 20. PowerSSO-36 LSD thermal impedance junction ambient single pulse 100 10 1 0.1 0.001 HSD-footprint HSD-2 cm^2 Cu HSD-8 cm^2 Cu HSD-4 Layer HsLsD-footprint HsLsD-2 cm^2 Cu HsLsD-8 cm^2 Cu HsLsD-4 Layer 0.01 0.1 1 time (sec 0.01 0.1 1 time (sec) ...
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... C21 = C22 = C23 (W.s/°C) 1. The blank space means that the value is the same as the previous one. 28/33 ( Footprint 0 0.1 3 0.0005 0.008 0.09 0.5 0.8 5 0.009 0.07 0.45 0.8 4 0.01 Doc ID 16009 Rev 10 VNH5050A 0.8 0.8 1 0.45 0. 0.006 ...
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... VNH5050A-E 5 Package and packing information ® 5.1 ECOPACK In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ® ECOPACK trademark. 5.2 PowerSSO-36 TP package information Figure 22 ...
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... Package and packing information Table 20. PowerSSO-36 TP mechanical data Symbol 30/33 Millimeters Min. Typ. 2. 0.18 - 0.23 - 10. 0.5 - 8 deg 0 1.2 0.8 2.9 3.65 1.0 1.85 3 1. 0.4 0.4 Doc ID 16009 Rev 10 VNH5050A-E Max. 2.47 2.40 0.1 0.36 0.32 10.50 7 0.1 10.5 0.4 8 deg 1 10 deg 2.35 3.5 2.35 3.5 5.2 3.5 ...
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... VNH5050A-E 5.3 PowerSSO-36 TP packing information Figure 23. PowerSSO-36 TP tube shipment (no suffix Figure 24. PowerSSO-36 TP tape and reel shipment (suffix “TR”) Tape dimensions According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb. 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter ...
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... Table 3: Suggested connections for unused and not connected pins Table 11: Protections and diagnostics 10 – TSD TR HYST Updated Figure 9: Waveforms in full-bridge operation Figure 10: Waveforms in full-bridge operation (continued) Doc ID 16009 Rev 10 VNH5050A-E Description of changes . < < 1.5 Ω LOAD < 1.5 Ω ...
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... VNH5050A-E Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...