SIP32454DB-T2-GE1 Vishay/Siliconix, SIP32454DB-T2-GE1 Datasheet - Page 10

• Manufacturer Part Number: SIP32454DB-T2-GE1
• Description: Power Switch ICs - Power Distribution Slew Rate Controled Loadswitch
• Manufacturer: Vishay/Siliconix

Specifications of SIP32454DB-T2-GE1

• Rohs: yes

SiP32454, SiP32455
Vishay Siliconix
PACKAGE OUTLINE
WCSP: 4 Bumps (2 x 2, 0.4 mm Pitch, 208 µm Bump Height, 0.8 mm x 0.8 mm Die Size)
Notes:
1. Laser mark on the backside surface of die.
2. Bumps are SAC396.
3. 0.050 max. coplanarity.
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see
www.vishay.com
10
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
Dimension
A1
D
A
b
e
0.4
Recommended Land Pattern
All dimensions in millimeters
www.vishay.com/ppg?62531
0.4
0.515
0.250
0.720
Min.
4 x Ø 0.150 to 0.200
Solder mask dia.
For technical questions, contact:
MILLIMETERS
Nom.
0.530
0.208
0.260
0.400
0.760
-
This document is subject to change without notice.
Pad diameter + 0.1
Index-Bump A1
MAX.
0.545
0.270
0.800
[e-mail]
Mark on backside of die
A
B
1
A
W
D
2
0.0202
0.0098
0.0182
Min.
4 x Ø b
INCHES
0.0208
0.0081
0.0102
0.0157
0.0193
Nom.
2
D
e
S12-0967-Rev. A, 07-May-12
Document Number: 62531
1
www.vishay.com/doc?91000
Bump Note 2
A
B
MAX.
0.0214
0.0106
0.0203