BGX7100HN/1,115 NXP Semiconductors, BGX7100HN/1,115 Datasheet - Page 32

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BGX7100HN/1,115

Manufacturer Part Number
BGX7100HN/1,115
Description
Modulator / Demodulator IQ MOD 5V 184mA
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BGX7100HN/1,115

Rohs
yes
Package / Case
HVQFN-24
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Modulation Type
Quadrature
Operating Supply Voltage
4.75 V to 5.25 V
Factory Pack Quantity
1500
Supply Current
184 mA
NXP Semiconductors
BGX7100
Product data sheet
17.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 15.
Table 16.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
< 2.5
 2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 15
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
All information provided in this document is subject to legal disclaimers.
16
54.
Rev. 5 — 3 September 2012
Package reflow temperature (C)
Volume (mm
< 350
235
220
Package reflow temperature (C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
350 to 2000
260
250
245
54) than a SnPb process, thus
 350
220
220
Transmitter IQ modulator
245
> 2000
260
245
BGX7100
© NXP B.V. 2012. All rights reserved.
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