93LC56B-I/SN Microchip Technology, 93LC56B-I/SN Datasheet - Page 17

• Manufacturer Part Number: 93LC56B-I/SN
• Description: IC EEPROM 2KBIT 3MHZ 8SOIC
• Manufacturer: Microchip Technology

Specifications of 93LC56B-I/SN

• Memory Size: 2K (128 x 16)
• Package / Case: 8-SOIC (3.9mm Width)
• Operating Temperature: -40°C ~ 85°C
• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Speed: 2MHz, 3MHz
• Interface: Microwire, 3-Wire Serial
• Voltage - Supply: 2.5 V ~ 5.5 V
• Organization: 128 K x 16
• Interface Type: Microwire
• Maximum Clock Frequency: 2 MHz
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2.5 V
• Maximum Operating Current: 0.5 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 2.5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 93LC56B-I/SNG

8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
 2003 Microchip Technology Inc.
93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005” (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-086
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
c
B
p
n
Dimension Limits
E1
E
Units
A2
E1
A1
D
p
A
E
L
B
n
c
MIN
.033
.246
.169
.114
.020
.004
.007
.002
0
0
0
INCHES
NOM
2
1
.026
.035
.004
.173
.118
.024
.006
.010
.251
8
4
5
5
D
L
MAX
.043
.037
.006
.256
.177
.122
.028
.008
.012
10
10
A1
8
A
MIN
0.85
0.05
6.25
4.30
2.90
0.50
0.09
0.19
0
0
0
MILLIMETERS*
NOM
0.65
0.90
0.10
6.38
4.40
3.00
0.60
0.15
0.25
8
4
5
5
A2
MAX
DS21794B-page 17
1.10
0.95
0.15
6.50
4.50
3.10
0.70
0.20
0.30
10
10
8